A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CERAMICS CIRCUIT BOARD
PROBLEM TO BE SOLVED: To obtain a ceramics circuit board excellent in heat dissipation, having mechanical properties to withstand the mechanical stress at the time of ultrasonic bonding, high bonding strength and excellent heat cycle, and enhancing the operation reliability as an electronic apparatus.SOLUTION: In a ceramics circuit board where both principal surfaces of an aluminum nitride substrate and a metal plate are bonded via a silver-copper-based brazing filler metal layer, composition of the silver-copper-based brazing filler metal layer is as follows. For 100 pts.mass of 75-98 pts.mass of silver powder, and 25-2 pts.mass of copper powder, content of graphite powder is 6.0-12.0 pts.mass, content of at least one kind of active metal selected from titanium, zirconium, hafnium, niobium, tantalum, vanadium and tin is 0.5-10 pts.mass, and the specific surface area of the graphite powder is 5-100 m/g.SELECTED DRAWING: None
【課題】超音波接合時の力学的応力に耐えられる機械特性、高い接合強度と優れた耐熱サイクル性を有し、電子機器としての動作信頼性を向上させるとともに、放熱性に優れたセラミックス回路基板を得ること。【解決手段】窒化アルミニウム基板の両主面と金属板が、銀−銅系ろう材層を介して接合されたセラミックス回路基板であって、銀−銅系ろう材層の構成が銀粉末７５〜９８質量部、銅粉末２５〜２質量部の合計１００質量部に対して、黒鉛（グラファイト）粉末の含有量が６．０〜１２．０質量部、チタン、ジルコニウム、ハフニウム、ニオブ、タンタル、バナジウム、錫から選択される少なくとも一種の活性金属の含有量が０．５〜１０質量部であり、上記黒鉛粉末の比表面積が、５〜１００ｍ２／ｇであることを特徴とするセラミックス回路基板。【選択図】なし
CERAMICS CIRCUIT BOARD
PROBLEM TO BE SOLVED: To obtain a ceramics circuit board excellent in heat dissipation, having mechanical properties to withstand the mechanical stress at the time of ultrasonic bonding, high bonding strength and excellent heat cycle, and enhancing the operation reliability as an electronic apparatus.SOLUTION: In a ceramics circuit board where both principal surfaces of an aluminum nitride substrate and a metal plate are bonded via a silver-copper-based brazing filler metal layer, composition of the silver-copper-based brazing filler metal layer is as follows. For 100 pts.mass of 75-98 pts.mass of silver powder, and 25-2 pts.mass of copper powder, content of graphite powder is 6.0-12.0 pts.mass, content of at least one kind of active metal selected from titanium, zirconium, hafnium, niobium, tantalum, vanadium and tin is 0.5-10 pts.mass, and the specific surface area of the graphite powder is 5-100 m/g.SELECTED DRAWING: None
【課題】超音波接合時の力学的応力に耐えられる機械特性、高い接合強度と優れた耐熱サイクル性を有し、電子機器としての動作信頼性を向上させるとともに、放熱性に優れたセラミックス回路基板を得ること。【解決手段】窒化アルミニウム基板の両主面と金属板が、銀−銅系ろう材層を介して接合されたセラミックス回路基板であって、銀−銅系ろう材層の構成が銀粉末７５〜９８質量部、銅粉末２５〜２質量部の合計１００質量部に対して、黒鉛（グラファイト）粉末の含有量が６．０〜１２．０質量部、チタン、ジルコニウム、ハフニウム、ニオブ、タンタル、バナジウム、錫から選択される少なくとも一種の活性金属の含有量が０．５〜１０質量部であり、上記黒鉛粉末の比表面積が、５〜１００ｍ２／ｇであることを特徴とするセラミックス回路基板。【選択図】なし
CERAMICS CIRCUIT BOARD
セラミックス回路基板
MIYATA KOJI (author) / AONO RYOTA (author) / MIYAGAWA KENJI (author)
2016-04-04
Patent
Electronic Resource
Japanese
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