A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METAL-CERAMICS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a metal-ceramics circuit board where a metal plate is joined to a ceramic substrate by an active metal-containing brazing material, and occurrence of migration can be suppressed sufficiently, and to provide a method of manufacturing the same.SOLUTION: After forming an oxide layer 12 on the surface (at least one surface) of a ceramics substrate 10 made of aluminum nitride, by oxidizing the ceramics substrate 10, an active metal-containing brazing material 14 is applied onto the oxide layer 12, a metal plate 15 is arranged on the active metal-containing brazing material 14, a metal plate 16 is joined to the ceramics substrate 10 via the active metal-containing brazing material 14 and oxide layer 12, thereafter, a plating film 18 is formed on the exposed surface of the active metal-containing brazing material 14.SELECTED DRAWING: Figure 1
【課題】活性金属含有ろう材によりセラミックス基板に金属板を接合した金属−セラミックス回路基板において、マイグレーションの発生を十分に抑制することができる、金属−セラミックス回路基板およびその製造方法を提供する。【解決手段】窒化アルミニウムからなるセラミックス基板１０を酸化してセラミックス基板１０の表面（少なくとも一方の面）に酸化層１２を形成した後、この酸化層１２上に活性金属含有ろう材１４を塗布し、この活性金属含有ろう材１４上に金属板１５を配置し、活性金属含有ろう材１４と酸化層１２を介して金属板１６をセラミックス基板１０に接合し、その後、活性金属含有ろう材１４の露出面にめっき皮膜１８を形成する。【選択図】図１
METAL-CERAMICS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a metal-ceramics circuit board where a metal plate is joined to a ceramic substrate by an active metal-containing brazing material, and occurrence of migration can be suppressed sufficiently, and to provide a method of manufacturing the same.SOLUTION: After forming an oxide layer 12 on the surface (at least one surface) of a ceramics substrate 10 made of aluminum nitride, by oxidizing the ceramics substrate 10, an active metal-containing brazing material 14 is applied onto the oxide layer 12, a metal plate 15 is arranged on the active metal-containing brazing material 14, a metal plate 16 is joined to the ceramics substrate 10 via the active metal-containing brazing material 14 and oxide layer 12, thereafter, a plating film 18 is formed on the exposed surface of the active metal-containing brazing material 14.SELECTED DRAWING: Figure 1
【課題】活性金属含有ろう材によりセラミックス基板に金属板を接合した金属−セラミックス回路基板において、マイグレーションの発生を十分に抑制することができる、金属−セラミックス回路基板およびその製造方法を提供する。【解決手段】窒化アルミニウムからなるセラミックス基板１０を酸化してセラミックス基板１０の表面（少なくとも一方の面）に酸化層１２を形成した後、この酸化層１２上に活性金属含有ろう材１４を塗布し、この活性金属含有ろう材１４上に金属板１５を配置し、活性金属含有ろう材１４と酸化層１２を介して金属板１６をセラミックス基板１０に接合し、その後、活性金属含有ろう材１４の露出面にめっき皮膜１８を形成する。【選択図】図１
METAL-CERAMICS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
金属−セラミックス回路基板およびその製造方法
KOBAYASHI KOJI (author) / SAWABE AKIO (author) / IDENO TAKASHI (author) / FURO MASAHIRO (author)
2016-05-12
Patent
Electronic Resource
Japanese
METAL-CERAMIC CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME
| European Patent Office | 2016
METAL-CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
| European Patent Office | 2015
METAL-CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
| European Patent Office | 2018
METAL-CERAMIC CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
| European Patent Office | 2021