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A platform for research: civil engineering, architecture and urbanism
MANUFACTURING METHOD OF ALUMINUM-CERAMIC JOINED BODY
PROBLEM TO BE SOLVED: To provide a manufacturing method of an aluminum-ceramic joined body which includes a heat dissipation function, to be used for an electronic component.SOLUTION: As a ceramic insulation substrate 1, two alumina substrates are prepared and poured into a casting mold after removing an oxide film. The casting mold is formed in such a manner that aluminum is poured in a planar shape over one side of the ceramic, aluminum is poured in a shape of a plate 3 over another side and further on the plate 3, straight fins 4 are formed in parallel with a base length direction on a surface at an opposite side to the surface in contact with the ceramic substrate 1. The casting mold is cooled, etching resist in a predetermined shape is printed on the surface of an aluminum plate 2, etching processing is performed with a ferric chloride solution, and a circuit pattern is formed. Next, after the resist is exfoliated, non-electrolytic Ni-P plating is applied onto aluminum, thereby providing a base integrated substrate with the fins in which the ceramic insulation substrate is directly joined to the two base plates.SELECTED DRAWING: Figure 1
【課題】電子部品に使用される放熱機能を有するアルミニウム−セラミックス接合体の製造方法を提供する。【解決手段】セラミックス絶縁基板１としてアルミナ基板を2枚用意し、酸化被膜を取り除き鋳型に流し込む。鋳型はセラミックスの一面に板状になるようにアルミニウムが流れ込み、他面に板３状になるようにアルミニウムが流れ込み、さらに板３にはセラミックス板１と接触する面と反対側の面にストレートフィン４がベース長手方向と平行に形成されるように流れ込む形状にする。この鋳型を冷却し、アルミニウム板２の表面に所定形状のエッチングレジストを印刷して、塩化第二鉄溶液にてエッチング処理し回路パターンを形成する。次いで、レジストを剥離した後、無電解Ni−Pメッキをアルミニウム上につけ、セラミックス絶縁基板が二枚のベース板に直接接合されたフィン付きベース一体型基板とした。【選択図】図１
MANUFACTURING METHOD OF ALUMINUM-CERAMIC JOINED BODY
PROBLEM TO BE SOLVED: To provide a manufacturing method of an aluminum-ceramic joined body which includes a heat dissipation function, to be used for an electronic component.SOLUTION: As a ceramic insulation substrate 1, two alumina substrates are prepared and poured into a casting mold after removing an oxide film. The casting mold is formed in such a manner that aluminum is poured in a planar shape over one side of the ceramic, aluminum is poured in a shape of a plate 3 over another side and further on the plate 3, straight fins 4 are formed in parallel with a base length direction on a surface at an opposite side to the surface in contact with the ceramic substrate 1. The casting mold is cooled, etching resist in a predetermined shape is printed on the surface of an aluminum plate 2, etching processing is performed with a ferric chloride solution, and a circuit pattern is formed. Next, after the resist is exfoliated, non-electrolytic Ni-P plating is applied onto aluminum, thereby providing a base integrated substrate with the fins in which the ceramic insulation substrate is directly joined to the two base plates.SELECTED DRAWING: Figure 1
【課題】電子部品に使用される放熱機能を有するアルミニウム−セラミックス接合体の製造方法を提供する。【解決手段】セラミックス絶縁基板１としてアルミナ基板を2枚用意し、酸化被膜を取り除き鋳型に流し込む。鋳型はセラミックスの一面に板状になるようにアルミニウムが流れ込み、他面に板３状になるようにアルミニウムが流れ込み、さらに板３にはセラミックス板１と接触する面と反対側の面にストレートフィン４がベース長手方向と平行に形成されるように流れ込む形状にする。この鋳型を冷却し、アルミニウム板２の表面に所定形状のエッチングレジストを印刷して、塩化第二鉄溶液にてエッチング処理し回路パターンを形成する。次いで、レジストを剥離した後、無電解Ni−Pメッキをアルミニウム上につけ、セラミックス絶縁基板が二枚のベース板に直接接合されたフィン付きベース一体型基板とした。【選択図】図１
MANUFACTURING METHOD OF ALUMINUM-CERAMIC JOINED BODY
アルミニウム−セラミックス接合体の製造方法
OSANAI HIDEYO (author) / NAMIOKA MUTSUMI (author) / IYODA KEN (author)
2016-04-07
Patent
Electronic Resource
Japanese
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