A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METAL-CERAMIC CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
To provide a metal-ceramic circuit board arranged so that one face of an aluminum metal circuit board is joined to one face of a ceramic substrate and a nickel layer is formed on the other face of the metal circuit board, in which the metal circuit board surface is hardly damaged or dented, the surface of the nickel layer is hardly splotched or discolored, and a resist hardly remains on the surface of the metal circuit board or nickel layer, and a method for manufacturing such a metal-ceramic circuit board.SOLUTION: A method for manufacturing a metal-ceramic circuit board comprises the steps of: forming a metal circuit board 12 made of aluminum or aluminum alloy on one face of a ceramic substrate 10; forming a nickel-plating coating film 18 on part of a surface of the metal circuit board; and then polishing the surface of the metal circuit board and nickel-plating coating film by a wet blast treatment to inject a polishing material slurry toward the surface of the metal circuit board and nickel layer at an injection pressure of 0.1-0.4 MPa, provided that the polishing material slurry includes, in its solution, preferably 5-25 vol.% of fine particles of at least one kind selected from a group consisting of a resin, glass and a ceramic.SELECTED DRAWING: Figure 2I
【課題】セラミックス基板の一方の面にアルミニウムからなる金属回路板の一方の面が接合し、金属回路板の他方の面にニッケル層が形成された金属−セラミックス回路基板において、金属回路板の表面にキズや打痕が生じ難く、ニッケル層の表面にしみや変色が生じ難く、金属回路板やニッケル層の表面にレジストが残存し難い、金属−セラミックス回路基板及びその製造方法を提供する。【解決手段】セラミックス基板１０の一方の面にアルミニウムまたはアルミニウム合金からなる金属回路板１２を形成し、金属回路板の表面の一部にニッケルめっき被膜１８を形成した後、金属回路板とニッケルめっき被膜の表面を（液体中に樹脂、ガラスおよびセラミックスからなる群から選ばれる少なくとも１種の微粒子を、好ましくは５〜２５体積％含む研磨材スラリーを噴射圧０．１〜０．４ＭＰａで金属回路板とニッケル層の表面に噴射するウェットブラスト処理により研磨する。【選択図】図２Ｉ
METAL-CERAMIC CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
To provide a metal-ceramic circuit board arranged so that one face of an aluminum metal circuit board is joined to one face of a ceramic substrate and a nickel layer is formed on the other face of the metal circuit board, in which the metal circuit board surface is hardly damaged or dented, the surface of the nickel layer is hardly splotched or discolored, and a resist hardly remains on the surface of the metal circuit board or nickel layer, and a method for manufacturing such a metal-ceramic circuit board.SOLUTION: A method for manufacturing a metal-ceramic circuit board comprises the steps of: forming a metal circuit board 12 made of aluminum or aluminum alloy on one face of a ceramic substrate 10; forming a nickel-plating coating film 18 on part of a surface of the metal circuit board; and then polishing the surface of the metal circuit board and nickel-plating coating film by a wet blast treatment to inject a polishing material slurry toward the surface of the metal circuit board and nickel layer at an injection pressure of 0.1-0.4 MPa, provided that the polishing material slurry includes, in its solution, preferably 5-25 vol.% of fine particles of at least one kind selected from a group consisting of a resin, glass and a ceramic.SELECTED DRAWING: Figure 2I
【課題】セラミックス基板の一方の面にアルミニウムからなる金属回路板の一方の面が接合し、金属回路板の他方の面にニッケル層が形成された金属−セラミックス回路基板において、金属回路板の表面にキズや打痕が生じ難く、ニッケル層の表面にしみや変色が生じ難く、金属回路板やニッケル層の表面にレジストが残存し難い、金属−セラミックス回路基板及びその製造方法を提供する。【解決手段】セラミックス基板１０の一方の面にアルミニウムまたはアルミニウム合金からなる金属回路板１２を形成し、金属回路板の表面の一部にニッケルめっき被膜１８を形成した後、金属回路板とニッケルめっき被膜の表面を（液体中に樹脂、ガラスおよびセラミックスからなる群から選ばれる少なくとも１種の微粒子を、好ましくは５〜２５体積％含む研磨材スラリーを噴射圧０．１〜０．４ＭＰａで金属回路板とニッケル層の表面に噴射するウェットブラスト処理により研磨する。【選択図】図２Ｉ
METAL-CERAMIC CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
金属−セラミックス回路基板およびその製造方法
YAMAMOTO AKIO (author) / IDEGUCHI SATORU (author)
2021-03-11
Patent
Electronic Resource
Japanese
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
B24C
ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
,
Abschleifendes oder ähnliches Abstrahlen mit teilchenförmigem Werkstoff
/
C04B
Kalk
,
LIME
/
C25D
Verfahren für die elektrolytische oder elektrophoretische Herstellung von Überzügen
,
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
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