A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METAL-CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
PROBLEM TO BE SOLVED: To provide a metal-ceramic circuit board which has less common difference between a top and a bottom of a circuit pattern even when a metal circuit board is thick and in which the metal circuit board having the circuit pattern with intended dimensional precision is bonded with a ceramic board; and provide a manufacturing method of the metal-ceramic circuit board.SOLUTION: A manufacturing method of a metal-ceramic circuit board comprises the steps of: bonding a circuit metal plate 12 which is formed to have a shape similar to a circuit pattern and has thickness at a part other than a part substantially corresponding to the circuit pattern to be thinner than thickness at the part substantially corresponding to the circuit pattern to a ceramic board 10; coating almost entire area of the circuit metal plate 12 with a resist; subsequently removing at least a part of the resist coated on a surface of the part other than the part substantially corresponding to the circuit pattern of the circuit metal plate 12; and removing the part other than the part substantially corresponding to the circuit pattern of the circuit metal plate 12 by etching processing.SELECTED DRAWING: Figure 4B
【課題】金属回路板が厚くても回路パターンのトップとボトムの寸法差が小さく、所望の寸法精度の回路パターンの金属回路板がセラミックス基板に接合した金属−セラミックス回路基板およびその製造方法を提供する。【解決手段】回路パターンに類似した形状になり且つ回路パターンに略対応する部分以外の厚さが回路パターンに略対応する部分の厚さより薄くなるように形成した回路用金属板１２をセラミックス基板１０に接合し、回路用金属板１２の略全面にレジストを塗布した後、回路用金属板１２の回路パターンに略対応する部分以外の部分の表面に塗布されたレジストの少なくとも一部を除去し、エッチング処理により回路用金属板１２の回路パターンに略対応する部分以外の部分を除去する。【選択図】図４Ｂ
METAL-CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
PROBLEM TO BE SOLVED: To provide a metal-ceramic circuit board which has less common difference between a top and a bottom of a circuit pattern even when a metal circuit board is thick and in which the metal circuit board having the circuit pattern with intended dimensional precision is bonded with a ceramic board; and provide a manufacturing method of the metal-ceramic circuit board.SOLUTION: A manufacturing method of a metal-ceramic circuit board comprises the steps of: bonding a circuit metal plate 12 which is formed to have a shape similar to a circuit pattern and has thickness at a part other than a part substantially corresponding to the circuit pattern to be thinner than thickness at the part substantially corresponding to the circuit pattern to a ceramic board 10; coating almost entire area of the circuit metal plate 12 with a resist; subsequently removing at least a part of the resist coated on a surface of the part other than the part substantially corresponding to the circuit pattern of the circuit metal plate 12; and removing the part other than the part substantially corresponding to the circuit pattern of the circuit metal plate 12 by etching processing.SELECTED DRAWING: Figure 4B
【課題】金属回路板が厚くても回路パターンのトップとボトムの寸法差が小さく、所望の寸法精度の回路パターンの金属回路板がセラミックス基板に接合した金属−セラミックス回路基板およびその製造方法を提供する。【解決手段】回路パターンに類似した形状になり且つ回路パターンに略対応する部分以外の厚さが回路パターンに略対応する部分の厚さより薄くなるように形成した回路用金属板１２をセラミックス基板１０に接合し、回路用金属板１２の略全面にレジストを塗布した後、回路用金属板１２の回路パターンに略対応する部分以外の部分の表面に塗布されたレジストの少なくとも一部を除去し、エッチング処理により回路用金属板１２の回路パターンに略対応する部分以外の部分を除去する。【選択図】図４Ｂ
METAL-CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
金属−セラミックス回路基板およびその製造方法
IDEGUCHI SATORU (author) / OSANAI HIDEYO (author)
2018-08-09
Patent
Electronic Resource
Japanese
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