A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METHOD OF MANUFACTURING WIRING BOARD AND WIRING BOARD
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board and a wiring board which can suppress the void from remaining in the brazing material when manufacturing the wiring board in which metal foils are joined by a brazing material.SOLUTION: In a first step, a brazing material foil 21 is disposed on the surface of a ceramic substrate 3, and in a second step, a metal foil 17 having an opening portion 23 is arranged so as to cover the brazing material foil 21. Then, in a third step, the brazing material is heated to a temperature at which the brazing material is melted, and the molten brazing material is filled in a through hole 11 and the opening portion 23, and thereafter, it is cooled and solidified. Voids may be generated in the melted brazing material due to generated gas and the like; however, since the metal foil 17 covering the brazing material foil 21 has the opening portion 23, the gas in the void is discharged to the outside through the opening portion 23 of the metal foil 17. Therefore, it is difficult for the voids to remain in the molten brazing material, so that voids are hard to remain even in the brazing material solidified by cooling afterwards.SELECTED DRAWING: Figure 2
【課題】金属箔がロー材によって接合された配線基板を製造する場合に、ロー材中にボイドが残存することを抑制できる配線基板の製造方法及び配線基板を提供すること。【解決手段】第１工程にて、セラミック基板３の表面にロー材箔２１を配置し、第２工程にて、開口部２３を有する金属箔１７をロー材箔２１を覆うように配置する。そして、第３工程にて、ロー材が溶融する温度に加熱して、溶融したロー材を貫通孔１１及び開口部２３に充填し、その後冷却して固化させる。溶融したロー材中には、発生したガス等によるボイドが生ずることがあるが、ロー材箔２１を覆う金属箔１７には開口部２３があるので、このボイド中のガスは金属箔１７の開口部２３を介して外部に排出される。そのため、溶融したロー材中にボイドが残存しにくく、よって、その後冷却して固化したロー材中にもボイドは残存しにくい。【選択図】図２
METHOD OF MANUFACTURING WIRING BOARD AND WIRING BOARD
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board and a wiring board which can suppress the void from remaining in the brazing material when manufacturing the wiring board in which metal foils are joined by a brazing material.SOLUTION: In a first step, a brazing material foil 21 is disposed on the surface of a ceramic substrate 3, and in a second step, a metal foil 17 having an opening portion 23 is arranged so as to cover the brazing material foil 21. Then, in a third step, the brazing material is heated to a temperature at which the brazing material is melted, and the molten brazing material is filled in a through hole 11 and the opening portion 23, and thereafter, it is cooled and solidified. Voids may be generated in the melted brazing material due to generated gas and the like; however, since the metal foil 17 covering the brazing material foil 21 has the opening portion 23, the gas in the void is discharged to the outside through the opening portion 23 of the metal foil 17. Therefore, it is difficult for the voids to remain in the molten brazing material, so that voids are hard to remain even in the brazing material solidified by cooling afterwards.SELECTED DRAWING: Figure 2
【課題】金属箔がロー材によって接合された配線基板を製造する場合に、ロー材中にボイドが残存することを抑制できる配線基板の製造方法及び配線基板を提供すること。【解決手段】第１工程にて、セラミック基板３の表面にロー材箔２１を配置し、第２工程にて、開口部２３を有する金属箔１７をロー材箔２１を覆うように配置する。そして、第３工程にて、ロー材が溶融する温度に加熱して、溶融したロー材を貫通孔１１及び開口部２３に充填し、その後冷却して固化させる。溶融したロー材中には、発生したガス等によるボイドが生ずることがあるが、ロー材箔２１を覆う金属箔１７には開口部２３があるので、このボイド中のガスは金属箔１７の開口部２３を介して外部に排出される。そのため、溶融したロー材中にボイドが残存しにくく、よって、その後冷却して固化したロー材中にもボイドは残存しにくい。【選択図】図２
METHOD OF MANUFACTURING WIRING BOARD AND WIRING BOARD
配線基板の製造方法及び配線基板
MORITA MASAHITO (author) / TSUKADA TETSUJI (author) / KACHI YUTAKA (author)
2017-01-12
Patent
Electronic Resource
Japanese
CERAMIC WIRING BOARD AND METHOD FOR MANUFACTURING CERAMIC WIRING BOARD
| European Patent Office | 2022
CERAMIC WIRING BOARD AND METHOD FOR MANUFACTURING CERAMIC WIRING BOARD
| European Patent Office | 2022