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A platform for research: civil engineering, architecture and urbanism
CERAMIC WIRING BOARD AND METHOD FOR MANUFACTURING CERAMIC WIRING BOARD
To suppress deterioration in withstand voltage characteristics of a resistor in a ceramic wiring board.SOLUTION: In a ceramic wiring board, a resistor containing a conductive material and a second glass is formed in a ceramic substrate containing a first glass. The composition of the first glass in the ceramic substrate and the composition of the second glass in the resistor are different from each other. The softening point Tsa of the first glass and the crystallization temperature Tcb of the second glass satisfy the following inequality (1): Tsa>Tcb.SELECTED DRAWING: Figure 1
【課題】セラミック配線基板において、抵抗体の耐電圧特性の悪化を抑制する。【解決手段】第１ガラスを含むセラミック基板に、導電性材料と第２ガラスとを含む抵抗体が形成されたセラミック配線基板において、セラミック基板中の第１ガラスの組成と、抵抗体中の第２ガラスの組成とが異なり、さらに、第１ガラスの軟化点Ｔｓａと第２ガラスの結晶化温度Ｔｃｂとが、下記の式（１）を満たす。Ｔｓａ＞Ｔｃｂ ・・（１）【選択図】図１
CERAMIC WIRING BOARD AND METHOD FOR MANUFACTURING CERAMIC WIRING BOARD
To suppress deterioration in withstand voltage characteristics of a resistor in a ceramic wiring board.SOLUTION: In a ceramic wiring board, a resistor containing a conductive material and a second glass is formed in a ceramic substrate containing a first glass. The composition of the first glass in the ceramic substrate and the composition of the second glass in the resistor are different from each other. The softening point Tsa of the first glass and the crystallization temperature Tcb of the second glass satisfy the following inequality (1): Tsa>Tcb.SELECTED DRAWING: Figure 1
【課題】セラミック配線基板において、抵抗体の耐電圧特性の悪化を抑制する。【解決手段】第１ガラスを含むセラミック基板に、導電性材料と第２ガラスとを含む抵抗体が形成されたセラミック配線基板において、セラミック基板中の第１ガラスの組成と、抵抗体中の第２ガラスの組成とが異なり、さらに、第１ガラスの軟化点Ｔｓａと第２ガラスの結晶化温度Ｔｃｂとが、下記の式（１）を満たす。Ｔｓａ＞Ｔｃｂ ・・（１）【選択図】図１
CERAMIC WIRING BOARD AND METHOD FOR MANUFACTURING CERAMIC WIRING BOARD
セラミック配線基板およびセラミック配線基板の製造方法
KUTSUNA MASAKI (author) / SEIKE AKIRA (author) / SHIKINE NOBUTAKA (author) / KIKUCHI MASASHI (author)
2022-05-19
Patent
Electronic Resource
Japanese
CERAMIC WIRING BOARD AND METHOD FOR MANUFACTURING CERAMIC WIRING BOARD
| European Patent Office | 2022