A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METHOD FOR MANUFACTURING CERAMIC WIRING BOARD
PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic wiring board capable of simplifying an etching process when forming a wiring pattern, and improving utilization efficiency of a brazing filler material.SOLUTION: A method for manufacturing a ceramic wiring board manufactures a ceramic wiring board 60 at least through: a brazing filler material layer forming step of forming a brazing filler material layer 20 containing a brazing filler material as a main component on a joint surface 14C of a copper plate 10 for joining provided with a groove 12G on at least a first surface 14; a joining step of joining an insulator substrate 30 and the copper plate 10 for joining by laminating and burning the insulator substrate 30 and the copper plate 10 for joining so that the brazing filler material layer 20 comes into contact with the insulator substrate 30; and an etching step of etching a surface 16 on the side provided with the copper plate 10 for joining of a laminate 42 in which the insulator substrate 30 and the copper plate 10 for joining are joined till the groove 12G becomes a through hole 12TH.SELECTED DRAWING: Figure 1
【課題】配線パターン形成時のエッチングプロセスを簡略化できると共に、ロウ材の利用効率を高めること。【解決手段】少なくとも第一面１４に溝１２Ｇが設けられた接合用銅板１０の接合面１４Ｃに、ロウ材を主成分として含むロウ材層２０を形成するロウ材層形成工程と、絶縁体基板３０と、接合用銅板１０とを、ロウ材層２０が絶縁体基板３０と接触するように積層して焼成することにより、絶縁体基板３０と接合用銅板１０とを接合する接合工程と、絶縁体基板３０と接合用銅板１０とが接合された積層体４２の接合用銅板１０が設けられた側の表面１６を、溝１２Ｇが貫通孔１２ＴＨとなるまでエッチングするエッチング工程と、を少なくとも経て、セラミックス配線板６０を製造するセラミックス配線板の製造方法。【選択図】図１
METHOD FOR MANUFACTURING CERAMIC WIRING BOARD
PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic wiring board capable of simplifying an etching process when forming a wiring pattern, and improving utilization efficiency of a brazing filler material.SOLUTION: A method for manufacturing a ceramic wiring board manufactures a ceramic wiring board 60 at least through: a brazing filler material layer forming step of forming a brazing filler material layer 20 containing a brazing filler material as a main component on a joint surface 14C of a copper plate 10 for joining provided with a groove 12G on at least a first surface 14; a joining step of joining an insulator substrate 30 and the copper plate 10 for joining by laminating and burning the insulator substrate 30 and the copper plate 10 for joining so that the brazing filler material layer 20 comes into contact with the insulator substrate 30; and an etching step of etching a surface 16 on the side provided with the copper plate 10 for joining of a laminate 42 in which the insulator substrate 30 and the copper plate 10 for joining are joined till the groove 12G becomes a through hole 12TH.SELECTED DRAWING: Figure 1
【課題】配線パターン形成時のエッチングプロセスを簡略化できると共に、ロウ材の利用効率を高めること。【解決手段】少なくとも第一面１４に溝１２Ｇが設けられた接合用銅板１０の接合面１４Ｃに、ロウ材を主成分として含むロウ材層２０を形成するロウ材層形成工程と、絶縁体基板３０と、接合用銅板１０とを、ロウ材層２０が絶縁体基板３０と接触するように積層して焼成することにより、絶縁体基板３０と接合用銅板１０とを接合する接合工程と、絶縁体基板３０と接合用銅板１０とが接合された積層体４２の接合用銅板１０が設けられた側の表面１６を、溝１２Ｇが貫通孔１２ＴＨとなるまでエッチングするエッチング工程と、を少なくとも経て、セラミックス配線板６０を製造するセラミックス配線板の製造方法。【選択図】図１
METHOD FOR MANUFACTURING CERAMIC WIRING BOARD
セラミックス配線板の製造方法
ONO KAORU (author) / HOSODA MAKOTO (author) / UEHARA YOSHIHITO (author)
2017-01-05
Patent
Electronic Resource
Japanese
CERAMIC WIRING BOARD AND METHOD FOR MANUFACTURING CERAMIC WIRING BOARD
| European Patent Office | 2022
CERAMIC WIRING BOARD AND METHOD FOR MANUFACTURING CERAMIC WIRING BOARD
| European Patent Office | 2022