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GROUND BORING METHOD
PROBLEM TO BE SOLVED: To provide a ground boring method capable of suppressing disturbance of a target ground when a hole from ground surface to the target ground is drilled.SOLUTION: A ground boring method comprises following steps to: insert a casing pipe 12 from a ground surface so that a tip of the casing pipe reaches a depth of a target ground (sandy soil layer G); selectively collect a stratum (cohesive soil layer F) inside the casing pipe 12 and cause non-collection layer Fa with a predetermined thickness to remain inside the casing pipe 12; and form a hole from the ground surface to the target ground (sandy soil layer G) by discharging the non-collection layer Fa from the inside of the casing pipe 12 and exposing the target ground inside the casing pipe 12.SELECTED DRAWING: Figure 5
【課題】地面から対象地盤に至る孔を掘削する際、対象地盤の乱れを抑制できる。【解決手段】地盤の削孔方法は、ケーシング管12を地面から対象地盤(砂質土層G)の深さに先端が位置するように挿入するステップと、ケーシング管12の内側の地層(粘性土層F)を選択的に採取して、ケーシング管12の内側に一定の厚みを備えた非採取層Faを残留させるステップと、非採取層Faをケーシング管12の内側から排出して、ケーシング管12の内側で対象地盤を露出させて、地面から対象地盤(砂質土層G)に至る孔を形成するステップと、を含む。【選択図】図5
GROUND BORING METHOD
PROBLEM TO BE SOLVED: To provide a ground boring method capable of suppressing disturbance of a target ground when a hole from ground surface to the target ground is drilled.SOLUTION: A ground boring method comprises following steps to: insert a casing pipe 12 from a ground surface so that a tip of the casing pipe reaches a depth of a target ground (sandy soil layer G); selectively collect a stratum (cohesive soil layer F) inside the casing pipe 12 and cause non-collection layer Fa with a predetermined thickness to remain inside the casing pipe 12; and form a hole from the ground surface to the target ground (sandy soil layer G) by discharging the non-collection layer Fa from the inside of the casing pipe 12 and exposing the target ground inside the casing pipe 12.SELECTED DRAWING: Figure 5
【課題】地面から対象地盤に至る孔を掘削する際、対象地盤の乱れを抑制できる。【解決手段】地盤の削孔方法は、ケーシング管12を地面から対象地盤(砂質土層G)の深さに先端が位置するように挿入するステップと、ケーシング管12の内側の地層(粘性土層F)を選択的に採取して、ケーシング管12の内側に一定の厚みを備えた非採取層Faを残留させるステップと、非採取層Faをケーシング管12の内側から排出して、ケーシング管12の内側で対象地盤を露出させて、地面から対象地盤(砂質土層G)に至る孔を形成するステップと、を含む。【選択図】図5
GROUND BORING METHOD
地盤の削孔方法
AGUI KATSUHITO (author) / SHINAGAWA SHUNSUKE (author)
2017-09-28
Patent
Electronic Resource
Japanese
IPC:
E02D
FOUNDATIONS
,
Gründungen
BORING METHOD OF GROUND RIGHT BELOW UNDERGROUND STRUCTURE
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