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BORING METHOD OF GROUND RIGHT BELOW UNDERGROUND STRUCTURE
To provide a boring method of the ground right below an underground structure capable of evenly boring even when solidity of the ground right below a bottom part of the underground structure is varied as well as modifying boring amount when boring amount among a plurality of boring devices varies.SOLUTION: A controller 60 comprises: a normal boring mode 61, a hard ground boring mode 62, and a boring difference modification mode 63, wherein the controller 60 evenly bores the ground right below a bottom part of an underground structure 10 as changing modes 61 to 63 in accordance with characters of the ground right below the underground structure 10.SELECTED DRAWING: Figure 4
【課題】地中構造物の底部の直下地盤の硬度が変化していても均等に掘削できると共に、複数の掘削装置の間に掘削差が生じた場合には掘削量を修正できる、地中構造物の直下地盤の掘削方法を提供すること。【解決手段】制御部60は通常掘削モード61と、硬質地盤掘削モード62と、掘削差修正モード63とを有し、制御部60は地中構造物10の直下地盤の性状に応じてモード61〜63を切り替えながら地中構造物10の底部の直下地盤を均等に掘削する。【選択図】図4
BORING METHOD OF GROUND RIGHT BELOW UNDERGROUND STRUCTURE
To provide a boring method of the ground right below an underground structure capable of evenly boring even when solidity of the ground right below a bottom part of the underground structure is varied as well as modifying boring amount when boring amount among a plurality of boring devices varies.SOLUTION: A controller 60 comprises: a normal boring mode 61, a hard ground boring mode 62, and a boring difference modification mode 63, wherein the controller 60 evenly bores the ground right below a bottom part of an underground structure 10 as changing modes 61 to 63 in accordance with characters of the ground right below the underground structure 10.SELECTED DRAWING: Figure 4
【課題】地中構造物の底部の直下地盤の硬度が変化していても均等に掘削できると共に、複数の掘削装置の間に掘削差が生じた場合には掘削量を修正できる、地中構造物の直下地盤の掘削方法を提供すること。【解決手段】制御部60は通常掘削モード61と、硬質地盤掘削モード62と、掘削差修正モード63とを有し、制御部60は地中構造物10の直下地盤の性状に応じてモード61〜63を切り替えながら地中構造物10の底部の直下地盤を均等に掘削する。【選択図】図4
BORING METHOD OF GROUND RIGHT BELOW UNDERGROUND STRUCTURE
地中構造物の直下地盤の掘削方法
YAMASHITA KYOICHI (author)
2019-10-31
Patent
Electronic Resource
Japanese
IPC:
E02D
FOUNDATIONS
,
Gründungen
European Patent Office | 2021
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