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MANUFACTURING METHOD OF LAMINATED SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR MODULE, LAMINATED SUBSTRATE, AND SEMICONDUCTOR MODULE
To easily and stably improve dielectric strength.SOLUTION: The method of manufacturing a laminated substrate, having an insulating substrate (2) made of ceramics and electrodes (3, 4) formed on a front surface of the insulating substrate, in which a semiconductor element is mountable on a front surface of the electrodes, includes laser-processing the front surface of the insulating substrate around the outside of the electrodes to modify the surface to be conductive. Thereby, it is possible to stably manufacture a high breakdown voltage laminated substrate by a simple method.SELECTED DRAWING: Figure 1C
【課題】絶縁耐圧を、容易に且つ安定して向上させること。【解決手段】本開示の積層基板の製造方法は、セラミックスからなる絶縁基板（２）と、絶縁基板のおもて面に形成された電極（３、４）と、を有し、電極のおもて面に半導体素子を実装可能な積層基板の製造方法であって、電極の外側の周囲における絶縁基板のおもて面を、レーザ加工して、導電性に表面改質した。これにより、簡単な手法により、高耐圧の積層基板を安定して製造することができる。【選択図】図１Ｃ
MANUFACTURING METHOD OF LAMINATED SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR MODULE, LAMINATED SUBSTRATE, AND SEMICONDUCTOR MODULE
To easily and stably improve dielectric strength.SOLUTION: The method of manufacturing a laminated substrate, having an insulating substrate (2) made of ceramics and electrodes (3, 4) formed on a front surface of the insulating substrate, in which a semiconductor element is mountable on a front surface of the electrodes, includes laser-processing the front surface of the insulating substrate around the outside of the electrodes to modify the surface to be conductive. Thereby, it is possible to stably manufacture a high breakdown voltage laminated substrate by a simple method.SELECTED DRAWING: Figure 1C
【課題】絶縁耐圧を、容易に且つ安定して向上させること。【解決手段】本開示の積層基板の製造方法は、セラミックスからなる絶縁基板（２）と、絶縁基板のおもて面に形成された電極（３、４）と、を有し、電極のおもて面に半導体素子を実装可能な積層基板の製造方法であって、電極の外側の周囲における絶縁基板のおもて面を、レーザ加工して、導電性に表面改質した。これにより、簡単な手法により、高耐圧の積層基板を安定して製造することができる。【選択図】図１Ｃ
MANUFACTURING METHOD OF LAMINATED SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR MODULE, LAMINATED SUBSTRATE, AND SEMICONDUCTOR MODULE
積層基板の製造方法、半導体モジュールの製造方法、並びに、積層基板、半導体モジュール
YAMASHIRO HIROSUKE (author)
2020-02-06
Patent
Electronic Resource
Japanese
| European Patent Office | 2022
| European Patent Office | 2015
LAMINATED STRUCTURE AND SEMICONDUCTOR MANUFACTURING DEVICE MEMBER
| European Patent Office | 2021
| European Patent Office | 2017