A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
LAMINATED STRUCTURE AND SEMICONDUCTOR MANUFACTURING DEVICE MEMBER
To provide a laminated structure in which damage to joint due to thermal stress in laminated structure is suppressed.SOLUTION: A laminated structure 10 includes a first structure formed of a composite sintered material containing AlN and MgAl2O4 as a main phase, and a second structure formed of a ceramic sintered material and laminated and joined to the first structure. Further, the difference in the coefficient of linear thermal expansion between the first structure and the second structure is 0.3 ppm/K or less. Thereby, damage to the joint between the first structure and the second structure due to thermal stress can be suppressed.SELECTED DRAWING: Figure 1
【課題】積層構造体において熱応力に起因する接合部の損傷を抑制する。【解決手段】積層構造体１０は、ＡｌＮおよびＭｇＡｌ２Ｏ４を主相として含む複合焼結体により形成される第１構造体と、セラミックス焼結体により形成され、当該第１構造体に積層されて接合される第２構造体と、を備える。そして、当該第１構造体と当該第２構造体との線熱膨張係数の差は、０．３ｐｐｍ／Ｋ以下である。これにより、熱応力に起因する第１構造体と第２構造体との接合部の損傷を抑制することができる。【選択図】図１
LAMINATED STRUCTURE AND SEMICONDUCTOR MANUFACTURING DEVICE MEMBER
To provide a laminated structure in which damage to joint due to thermal stress in laminated structure is suppressed.SOLUTION: A laminated structure 10 includes a first structure formed of a composite sintered material containing AlN and MgAl2O4 as a main phase, and a second structure formed of a ceramic sintered material and laminated and joined to the first structure. Further, the difference in the coefficient of linear thermal expansion between the first structure and the second structure is 0.3 ppm/K or less. Thereby, damage to the joint between the first structure and the second structure due to thermal stress can be suppressed.SELECTED DRAWING: Figure 1
【課題】積層構造体において熱応力に起因する接合部の損傷を抑制する。【解決手段】積層構造体１０は、ＡｌＮおよびＭｇＡｌ２Ｏ４を主相として含む複合焼結体により形成される第１構造体と、セラミックス焼結体により形成され、当該第１構造体に積層されて接合される第２構造体と、を備える。そして、当該第１構造体と当該第２構造体との線熱膨張係数の差は、０．３ｐｐｍ／Ｋ以下である。これにより、熱応力に起因する第１構造体と第２構造体との接合部の損傷を抑制することができる。【選択図】図１
LAMINATED STRUCTURE AND SEMICONDUCTOR MANUFACTURING DEVICE MEMBER
積層構造体および半導体製造装置部材
NAGAI ASUMI (author) / NISHIMURA NOBORU (author) / YAMAGUCHI HIROFUMI (author)
2021-10-07
Patent
Electronic Resource
Japanese
| European Patent Office | 2015
| European Patent Office | 2025