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MANUFACTURING METHOD OF CONJUGANT, MANUFACTURING METHOD OF INSULATIVE CIRCUIT BOARD, CERAMIC BOARD, CONJUGANT, AND INSULATIVE CIRCUIT BOARD
To provide a method of manufacturing a conjugant, which enables the reliable conjugation between a metal member and a ceramic member made of aluminum nitride or silicon nitride even in a conjugation condition of a low temperature and a short time and which is superior in cooling/heating cycle reliability.SOLUTION: A method of manufacturing a conjugant arranged by conjugating a metal member and a ceramic member made of aluminum nitride or silicon nitride comprises: a surface oxygen density adjustment step S01 of bringing a surface oxygen density of the ceramic member into a range of 25 atom% or more and 50 atom% or less; and a conjugating step S03 of conjugating the metal member to a surface of the ceramic member of which the surface oxygen density is put in the range of 25 atom% or more and 50 atom% or less. The surface oxygen density adjustment step S01 includes an oxidizing step S11 of oxidizing the surface of the ceramic member and an etching process step S12 of dissolving the surface of the ceramic member by a process liquid, whereby an amorphous oxide layer is formed on the surface of the ceramic member.SELECTED DRAWING: Figure 2
【課題】低温・短時間の接合条件であっても、金属部材と窒化アルミニウム又は窒化ケイ素からなるセラミックス部材とを確実に接合することができ、冷熱サイクル信頼性に優れた接合体の製造方法を提供する。【解決手段】金属部材と、窒化アルミニウム又は窒化ケイ素からなるセラミックス部材とが接合されてなる接合体の製造方法であって、前記セラミックス部材の表面酸素濃度を２５原子％以上５０原子％以下の範囲内とする表面酸素濃度調整工程Ｓ０１と、表面酸素濃度が２５原子％以上５０原子％以下の範囲内とされた前記セラミックス部材の表面に前記金属部材を接合する接合工程Ｓ０３と、を有し、表面酸素濃度調整工程Ｓ０１は、前記セラミックス部材の表面を酸化させる酸化処理工程Ｓ１１と、処理液によって前記セラミックス部材の表面を溶解するエッチング処理工程Ｓ１２と、を備えており、前記セラミックス部材の表面に非晶質酸化物層を形成する。【選択図】図２
MANUFACTURING METHOD OF CONJUGANT, MANUFACTURING METHOD OF INSULATIVE CIRCUIT BOARD, CERAMIC BOARD, CONJUGANT, AND INSULATIVE CIRCUIT BOARD
To provide a method of manufacturing a conjugant, which enables the reliable conjugation between a metal member and a ceramic member made of aluminum nitride or silicon nitride even in a conjugation condition of a low temperature and a short time and which is superior in cooling/heating cycle reliability.SOLUTION: A method of manufacturing a conjugant arranged by conjugating a metal member and a ceramic member made of aluminum nitride or silicon nitride comprises: a surface oxygen density adjustment step S01 of bringing a surface oxygen density of the ceramic member into a range of 25 atom% or more and 50 atom% or less; and a conjugating step S03 of conjugating the metal member to a surface of the ceramic member of which the surface oxygen density is put in the range of 25 atom% or more and 50 atom% or less. The surface oxygen density adjustment step S01 includes an oxidizing step S11 of oxidizing the surface of the ceramic member and an etching process step S12 of dissolving the surface of the ceramic member by a process liquid, whereby an amorphous oxide layer is formed on the surface of the ceramic member.SELECTED DRAWING: Figure 2
【課題】低温・短時間の接合条件であっても、金属部材と窒化アルミニウム又は窒化ケイ素からなるセラミックス部材とを確実に接合することができ、冷熱サイクル信頼性に優れた接合体の製造方法を提供する。【解決手段】金属部材と、窒化アルミニウム又は窒化ケイ素からなるセラミックス部材とが接合されてなる接合体の製造方法であって、前記セラミックス部材の表面酸素濃度を２５原子％以上５０原子％以下の範囲内とする表面酸素濃度調整工程Ｓ０１と、表面酸素濃度が２５原子％以上５０原子％以下の範囲内とされた前記セラミックス部材の表面に前記金属部材を接合する接合工程Ｓ０３と、を有し、表面酸素濃度調整工程Ｓ０１は、前記セラミックス部材の表面を酸化させる酸化処理工程Ｓ１１と、処理液によって前記セラミックス部材の表面を溶解するエッチング処理工程Ｓ１２と、を備えており、前記セラミックス部材の表面に非晶質酸化物層を形成する。【選択図】図２
MANUFACTURING METHOD OF CONJUGANT, MANUFACTURING METHOD OF INSULATIVE CIRCUIT BOARD, CERAMIC BOARD, CONJUGANT, AND INSULATIVE CIRCUIT BOARD
接合体の製造方法、絶縁回路基板の製造方法、セラミックス基板、接合体、及び、絶縁回路基板
TERASAKI NOBUYUKI (author)
2020-06-18
Patent
Electronic Resource
Japanese
European Patent Office | 2015