A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC JOINED BODY AND INSULATIVE CIRCUIT BOARD
A copper/ceramic bonded body (10) is provided, including: a copper member (12, 13) made of copper or a copper alloy; and a ceramic member (11), the copper member (12, 13) and the ceramic member (11) being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom% or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member (12, 13) and the ceramic member (11) to a copper member (12, 13) side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom%.
COPPER/CERAMIC JOINED BODY AND INSULATIVE CIRCUIT BOARD
A copper/ceramic bonded body (10) is provided, including: a copper member (12, 13) made of copper or a copper alloy; and a ceramic member (11), the copper member (12, 13) and the ceramic member (11) being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom% or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member (12, 13) and the ceramic member (11) to a copper member (12, 13) side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom%.
COPPER/CERAMIC JOINED BODY AND INSULATIVE CIRCUIT BOARD
KUPFER/KERAMIK-VERBUNDKÖRPER UND ISOLIERENDE SCHALTUNGSPLATTE
CORPS ASSEMBLÉ EN CUIVRE/CÉRAMIQUE ET CARTE DE CIRCUIT IMPRIMÉ ISOLANTE
TERASAKI NOBUYUKI (author)
2023-10-04
Patent
Electronic Resource
English
| European Patent Office | 2023
| European Patent Office | 2020