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LASER BEAM MACHINING APPARATUS FOR BRITTLE MATERIAL SUBSTRATE
To provide a laser beam machining apparatus allowing for increase of a hole depth in a thickness direction, of a brittle material substrate while suppressing thermal damage to vicinity of a surface of the brittle material substrate.SOLUTION: The laser beam machining apparatus comprises: a galvano mirror so arranged as to receive an incident laser beam; an fθ lens which is so arranged as to receive an incident laser beam emitted from the galvano mirror and also irradiate the brittle material surface perpendicularly from above; a drive mechanism which changes the focus of the laser beam in a thickness direction from a surface of the brittle material substrate; and a control unit which controls the attitude of the galvano mirror so as to scan the surface of the brittle material substrate with the laser beam, and also controls the output of the laser beam to increase with an increase in the distance from the surface of the brittle material substrate.SELECTED DRAWING: Figure 2
【課題】脆性材料基板の表面付近における熱ダメージを抑制しつつ厚み方向における穴深さを向上させることができる、レーザー加工装置を提供する。【解決手段】レーザービームが入射可能に配置されたガルバノミラーと、ガルバノミラーから出射されたレーザービームを入射可能に、かつ脆性材料基板に対して鉛直上方から照射可能に配置されたｆθレンズと、レーザービームの焦点を脆性材料基板の表面から厚み方向に変化させる駆動機構と、レーザービームが脆性材料基板の表面を走査するようにガルバノミラーの姿勢を制御し、かつレーザービームの出力を焦点が脆性材料基板の表面から遠ざかるほど増大させるように制御する制御部と、を備える。【選択図】図２
LASER BEAM MACHINING APPARATUS FOR BRITTLE MATERIAL SUBSTRATE
To provide a laser beam machining apparatus allowing for increase of a hole depth in a thickness direction, of a brittle material substrate while suppressing thermal damage to vicinity of a surface of the brittle material substrate.SOLUTION: The laser beam machining apparatus comprises: a galvano mirror so arranged as to receive an incident laser beam; an fθ lens which is so arranged as to receive an incident laser beam emitted from the galvano mirror and also irradiate the brittle material surface perpendicularly from above; a drive mechanism which changes the focus of the laser beam in a thickness direction from a surface of the brittle material substrate; and a control unit which controls the attitude of the galvano mirror so as to scan the surface of the brittle material substrate with the laser beam, and also controls the output of the laser beam to increase with an increase in the distance from the surface of the brittle material substrate.SELECTED DRAWING: Figure 2
【課題】脆性材料基板の表面付近における熱ダメージを抑制しつつ厚み方向における穴深さを向上させることができる、レーザー加工装置を提供する。【解決手段】レーザービームが入射可能に配置されたガルバノミラーと、ガルバノミラーから出射されたレーザービームを入射可能に、かつ脆性材料基板に対して鉛直上方から照射可能に配置されたｆθレンズと、レーザービームの焦点を脆性材料基板の表面から厚み方向に変化させる駆動機構と、レーザービームが脆性材料基板の表面を走査するようにガルバノミラーの姿勢を制御し、かつレーザービームの出力を焦点が脆性材料基板の表面から遠ざかるほど増大させるように制御する制御部と、を備える。【選択図】図２
LASER BEAM MACHINING APPARATUS FOR BRITTLE MATERIAL SUBSTRATE
脆性材料基板のレーザー加工装置
KOKUSHO TOMOJI (author) / MAEDA KENICHI (author)
2020-08-13
Patent
Electronic Resource
Japanese
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