A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE FOR BRITTLE MATERIAL SUBSTRATE
PROBLEM TO BE SOLVED: To provide a laser processing method for a brittle material substrate capable of improving a processing depth in the thickness direction, while suppressing heat damage around a surface of the brittle material substrate.SOLUTION: When forming a hole in the thickness direction from the surface of a brittle material substrate by application of a laser beam, the application of a laser beam to the brittle material substrate is performed while changing a focal point of the laser beam from the surface of the brittle material substrate in the thickness direction, and increasing output of the laser beam as the focal point is separated gradually from the surface of the brittle material substrate.SELECTED DRAWING: Figure 2
【課題】脆性材料基板の表面付近における熱ダメージを抑制しつつ厚み方向における加工深さを向上させることができる、脆性材料基板のレーザー加工方法を提供する。【解決手段】レーザービームを照射することによって脆性材料基板の表面から厚み方向に穴を形成する際の、脆性材料基板に対するレーザービームの照射を、レーザービームの焦点を脆性材料基板の表面から厚み方向に変化させながら、かつ、焦点が脆性材料基板の表面から遠ざかるほどレーザービームの出力を増大させながら、行うようにする。【選択図】図２
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE FOR BRITTLE MATERIAL SUBSTRATE
PROBLEM TO BE SOLVED: To provide a laser processing method for a brittle material substrate capable of improving a processing depth in the thickness direction, while suppressing heat damage around a surface of the brittle material substrate.SOLUTION: When forming a hole in the thickness direction from the surface of a brittle material substrate by application of a laser beam, the application of a laser beam to the brittle material substrate is performed while changing a focal point of the laser beam from the surface of the brittle material substrate in the thickness direction, and increasing output of the laser beam as the focal point is separated gradually from the surface of the brittle material substrate.SELECTED DRAWING: Figure 2
【課題】脆性材料基板の表面付近における熱ダメージを抑制しつつ厚み方向における加工深さを向上させることができる、脆性材料基板のレーザー加工方法を提供する。【解決手段】レーザービームを照射することによって脆性材料基板の表面から厚み方向に穴を形成する際の、脆性材料基板に対するレーザービームの照射を、レーザービームの焦点を脆性材料基板の表面から厚み方向に変化させながら、かつ、焦点が脆性材料基板の表面から遠ざかるほどレーザービームの出力を増大させながら、行うようにする。【選択図】図２
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE FOR BRITTLE MATERIAL SUBSTRATE
脆性材料基板のレーザー加工方法およびレーザー加工装置
KOKUSHO TOMOJI (author) / MAEDA KENICHI (author)
2018-02-01
Patent
Electronic Resource
Japanese
IPC:
C03B
Herstellung oder Formgebung von Glas, Mineral- oder Schlackenwolle
,
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
/
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
C03C
Chemische Zusammensetzungen für Gläser, Glasuren oder Emails
,
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
/
C04B
Kalk
,
LIME
/
C30B
SINGLE-CRYSTAL GROWTH
,
Züchten von Einkristallen
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE OF BRITTLE MATERIAL SUBSTRATE
| European Patent Office | 2018
LASER BEAM MACHINING APPARATUS FOR BRITTLE MATERIAL SUBSTRATE
| European Patent Office | 2020
Micro and nanoscale laser processing of hard brittle materials
| UB Braunschweig | 2019
Improving the adobe material properties by laser material processing
| Elsevier | 2020
DISCHARGE DEVICE, SUBSTRATE PROCESSING STRUCTURE AND SUBSTRATE PROCESSING METHOD
| European Patent Office | 2022