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A platform for research: civil engineering, architecture and urbanism
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE OF BRITTLE MATERIAL SUBSTRATE
PROBLEM TO BE SOLVED: To provide a laser processing method of a brittle material substrate which can shorten a processing time while suppressing thermal damage as compared with a conventional one and can process at a narrow pitch in processing a plurality of portions on a rear surface side in a thickness direction by irradiating a front side of the brittle material substrate with laser.SOLUTION: In forming a plurality of holes in a thickness direction from a rear surface of a brittle material substrate by irradiating a front surface side of the brittle material substrate with a laser beam, the plurality of holes are formed gradually by repeating change of a processing object portion at one height position each time irradiation of the laser beam at the one height position on the one processing object portion is completed, and shift of a focal point of the laser beam by a predetermined distance in the thickness direction from the rear surface of the brittle material substrate to a new height position each time the irradiation of the laser beam on all processing object portions at the one height position is completed.SELECTED DRAWING: Figure 4
【課題】脆性材料基板の表面側からレーザーを照射することによって裏面側の複数箇所において厚み方向への加工を行う場合において、従来よりも熱ダメージを抑制しつつ加工時間を短縮し、さらには狭ピッチでの加工が行える、脆性材料基板のレーザー加工方法を提供する。【解決手段】レーザービームを脆性材料基板の表面側から照射することによって脆性材料基板の裏面から厚み方向に複数の穴を形成する際に、一の加工対象箇所における一の高さ位置でのレーザービームの照射が終了する都度、一の高さ位置において加工対象箇所を切り替え、一の高さ位置での全ての加工対象箇所におけるレーザービームの照射が終了する都度、レーザービームの焦点を脆性材料基板の裏面から厚み方向に所定距離移動させて焦点を新たな高さ位置にすることを、繰り返すことにより、複数の穴を漸次に形成するようにする。【選択図】図４
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE OF BRITTLE MATERIAL SUBSTRATE
PROBLEM TO BE SOLVED: To provide a laser processing method of a brittle material substrate which can shorten a processing time while suppressing thermal damage as compared with a conventional one and can process at a narrow pitch in processing a plurality of portions on a rear surface side in a thickness direction by irradiating a front side of the brittle material substrate with laser.SOLUTION: In forming a plurality of holes in a thickness direction from a rear surface of a brittle material substrate by irradiating a front surface side of the brittle material substrate with a laser beam, the plurality of holes are formed gradually by repeating change of a processing object portion at one height position each time irradiation of the laser beam at the one height position on the one processing object portion is completed, and shift of a focal point of the laser beam by a predetermined distance in the thickness direction from the rear surface of the brittle material substrate to a new height position each time the irradiation of the laser beam on all processing object portions at the one height position is completed.SELECTED DRAWING: Figure 4
【課題】脆性材料基板の表面側からレーザーを照射することによって裏面側の複数箇所において厚み方向への加工を行う場合において、従来よりも熱ダメージを抑制しつつ加工時間を短縮し、さらには狭ピッチでの加工が行える、脆性材料基板のレーザー加工方法を提供する。【解決手段】レーザービームを脆性材料基板の表面側から照射することによって脆性材料基板の裏面から厚み方向に複数の穴を形成する際に、一の加工対象箇所における一の高さ位置でのレーザービームの照射が終了する都度、一の高さ位置において加工対象箇所を切り替え、一の高さ位置での全ての加工対象箇所におけるレーザービームの照射が終了する都度、レーザービームの焦点を脆性材料基板の裏面から厚み方向に所定距離移動させて焦点を新たな高さ位置にすることを、繰り返すことにより、複数の穴を漸次に形成するようにする。【選択図】図４
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE OF BRITTLE MATERIAL SUBSTRATE
脆性材料基板のレーザー加工方法およびレーザー加工装置
MAEDA KENICHI (author) / KOKUSHO TOMOJI (author)
2018-02-01
Patent
Electronic Resource
Japanese
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