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GLASS POWDER, DIELECTRIC MATERIAL, SINTERED BODY, AND HIGH FREQUENCY CIRCUIT MEMBER
To provide a glass powder that can be fired at a temperature of 1000°C or lower, and has low relative dielectric constants and dielectric loss tangents in a high frequency region, a dielectric material, a sintered body, and a high frequency circuit member.SOLUTION: The glass powder according to the present invention comprises an alkaline borosilicate glass and is characterized by containing, in the glass composition, 0.1-1.0 mol% (but not including 1.0 mol%) of Li2O+Na2O+K2O, wherein the mole ratio Li2O/(Li2O+Na2O+K2O) is 0.35-0.65, the mole ratio Na2O/(Li2O+Na2O+K2O) is 0.25-0.55, the mole ratio K2O/(Li2O+Na2O+K2O) is 0.025-0.20, and the glass powder has a relative permittivity of 3.5-4.0 at 16 GHz and 25°C and has a dielectric loss tangent of 0.0020 or less at 16 GHz and 25°C.SELECTED DRAWING: Figure 1
【課題】1000℃以下の温度で焼成でき、しかも高周波領域において、低い比誘電率及び誘電正接を有するガラス粉末、誘電体材料、焼結体及び高周波用回路部材を提供する。【解決手段】本発明のガラス粉末は、アルカリホウケイ酸ガラスからなるガラス粉末において、ガラス組成中にLi2O+Na2O+K2Oを0.1〜1.0モル%(但し1.0モル%を含まず)含み、モル比Li2O/(Li2O+Na2O+K2O)が0.35〜0.65、モル比Na2O/(Li2O+Na2O+K2O)が0.25〜0.55、モル比K2O/(Li2O+Na2O+K2O)が0.025〜0.20であり、且つ25℃、16GHzでの比誘電率が3.5〜4.0であり、25℃、16GHzでの誘電正接が0.0020以下であることを特徴とする。【選択図】図1
GLASS POWDER, DIELECTRIC MATERIAL, SINTERED BODY, AND HIGH FREQUENCY CIRCUIT MEMBER
To provide a glass powder that can be fired at a temperature of 1000°C or lower, and has low relative dielectric constants and dielectric loss tangents in a high frequency region, a dielectric material, a sintered body, and a high frequency circuit member.SOLUTION: The glass powder according to the present invention comprises an alkaline borosilicate glass and is characterized by containing, in the glass composition, 0.1-1.0 mol% (but not including 1.0 mol%) of Li2O+Na2O+K2O, wherein the mole ratio Li2O/(Li2O+Na2O+K2O) is 0.35-0.65, the mole ratio Na2O/(Li2O+Na2O+K2O) is 0.25-0.55, the mole ratio K2O/(Li2O+Na2O+K2O) is 0.025-0.20, and the glass powder has a relative permittivity of 3.5-4.0 at 16 GHz and 25°C and has a dielectric loss tangent of 0.0020 or less at 16 GHz and 25°C.SELECTED DRAWING: Figure 1
【課題】1000℃以下の温度で焼成でき、しかも高周波領域において、低い比誘電率及び誘電正接を有するガラス粉末、誘電体材料、焼結体及び高周波用回路部材を提供する。【解決手段】本発明のガラス粉末は、アルカリホウケイ酸ガラスからなるガラス粉末において、ガラス組成中にLi2O+Na2O+K2Oを0.1〜1.0モル%(但し1.0モル%を含まず)含み、モル比Li2O/(Li2O+Na2O+K2O)が0.35〜0.65、モル比Na2O/(Li2O+Na2O+K2O)が0.25〜0.55、モル比K2O/(Li2O+Na2O+K2O)が0.025〜0.20であり、且つ25℃、16GHzでの比誘電率が3.5〜4.0であり、25℃、16GHzでの誘電正接が0.0020以下であることを特徴とする。【選択図】図1
GLASS POWDER, DIELECTRIC MATERIAL, SINTERED BODY, AND HIGH FREQUENCY CIRCUIT MEMBER
ガラス粉末、誘電体材料、焼結体及び高周波用回路部材
UMAYAHARA YOSHIO (author)
2021-02-22
Patent
Electronic Resource
Japanese
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