A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CERAMIC CIRCUIT BOARD ASSEMBLY AND CERAMIC CIRCUIT BOARD MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To provide a ceramic circuit board assembly.SOLUTION: A ceramic circuit board assembly comprises: a ceramic circuit board including a metal circuit board bonded to one principal surface of a ceramic mother board via bonding layer and a metal heat sink bonded to the other principal surface via a bonding layer; a dummy part including a dummy metal plate which is made of the same material and has the same thickness with the metal circuit board bonded to an outer peripheral part of the one principal surface via the bonding layer, and a dummy metal plate which is made of the same material and has the same thickness with the metal heat sink bonded to an outer peripheral part of the other principal surface via the bonding layer; and division grooves for dividing the ceramic circuit board and the dummy part, respectively, in which the dummy part is used for measurement of thermal conductivity.SELECTED DRAWING: Figure 1
【課題】セラミックス回路基板集合体を提供することにある。【解決手段】セラミックス母基板の一方の主面に接合層を介して接合した金属回路板と、他方の主面に接合層を介して接合した金属放熱板とを備えるセラミックス回路基板を有し、さらに、前記一方主面の外周辺部に接合層を介して接合した前記金属回路板と同材質且つ同一厚さのダミー金属板と、前記他方の主面の外周辺部に接合層を介して接合した前記金属放熱板と同材質且つ同一厚さのダミー金属板とを備えるダミー部を有し、前記セラミックス回路基板および前記ダミー部をそれぞれ分割するための分割溝が設けられており、前記ダミー部が熱伝導率測定に用いられることを特徴とするセラミックス回路基板集合体。【選択図】図１
CERAMIC CIRCUIT BOARD ASSEMBLY AND CERAMIC CIRCUIT BOARD MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To provide a ceramic circuit board assembly.SOLUTION: A ceramic circuit board assembly comprises: a ceramic circuit board including a metal circuit board bonded to one principal surface of a ceramic mother board via bonding layer and a metal heat sink bonded to the other principal surface via a bonding layer; a dummy part including a dummy metal plate which is made of the same material and has the same thickness with the metal circuit board bonded to an outer peripheral part of the one principal surface via the bonding layer, and a dummy metal plate which is made of the same material and has the same thickness with the metal heat sink bonded to an outer peripheral part of the other principal surface via the bonding layer; and division grooves for dividing the ceramic circuit board and the dummy part, respectively, in which the dummy part is used for measurement of thermal conductivity.SELECTED DRAWING: Figure 1
【課題】セラミックス回路基板集合体を提供することにある。【解決手段】セラミックス母基板の一方の主面に接合層を介して接合した金属回路板と、他方の主面に接合層を介して接合した金属放熱板とを備えるセラミックス回路基板を有し、さらに、前記一方主面の外周辺部に接合層を介して接合した前記金属回路板と同材質且つ同一厚さのダミー金属板と、前記他方の主面の外周辺部に接合層を介して接合した前記金属放熱板と同材質且つ同一厚さのダミー金属板とを備えるダミー部を有し、前記セラミックス回路基板および前記ダミー部をそれぞれ分割するための分割溝が設けられており、前記ダミー部が熱伝導率測定に用いられることを特徴とするセラミックス回路基板集合体。【選択図】図１
CERAMIC CIRCUIT BOARD ASSEMBLY AND CERAMIC CIRCUIT BOARD MANUFACTURING METHOD
セラミックス回路基板集合体及びセラミックス回路基板の製造方法
WATANABE JUNICHI (author) / KAGA YOICHIRO (author) / IMAMURA TOSHIYUKI (author)
2016-03-10
Patent
Electronic Resource
Japanese
| European Patent Office | 2022
| European Patent Office | 2020
CERAMIC CIRCUIT BOARD AND METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
| European Patent Office | 2017
| European Patent Office | 2021
| European Patent Office | 2021