A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METAL-CERAMIC BONDING BOARD AND MANUFACTURING METHOD THEREOF
To provide a metal-ceramic bonding board and a manufacturing method thereof, capable of satisfactorily bonding a copper plate to a ceramic substrate even when heated at a low temperature while applying a conventionally low load.SOLUTION: The present invention provides a manufacturing method of a metal-ceramic bonding board in which an active metal material 12 containing only an active metal as a metal component and a brazing material 14 containing only a metal other than the active metal as a metal component and containing P are prepared, a ratio of mass of the metal component of the active metal material 12 to total mass of the metal component of the active metal material 12 and the metal component and P of the brazing material 14 is regulated in 5 mass% or less, the active metal material 12 is arranged on one surface of a ceramic substrate 10, the brazing material 14 is arranged on one surface of a copper plate 16, and the ceramic substrate 10 and the copper plate 16 are arranged so that the active metal material 12 and the brazing material 14 are contacted, and subsequently the copper plate 16 is joined to the ceramic substrate 10 by heating at 780 to 890°C while applying a load of 0.005 to 0.5 kgf/cm2 between the ceramic substrate 10 and the copper plate 16.SELECTED DRAWING: Figure 2
【課題】従来よりも低い荷重を加えながら低い温度で加熱しても、銅板をセラミックス基板に良好に接合することができる、金属−セラミックス接合基板およびその製造方法を提供する。【解決手段】金属成分として活性金属のみを含む活性金属材１２と、金属成分として活性金属以外の金属のみを含み且つＰを含むろう材１４を用意し、活性金属材１２の金属成分とろう材１４の金属成分およびＰとの合計の質量に対する活性金属材１２の金属成分の質量の割合を５質量％以下として、セラミックス基板１０の一方の面に活性金属材１２を配置するとともに、銅板１６の一方の面にろう材１４を配置し、セラミックス基板１０と銅板１６とを、活性金属材１２とろう材１４が当接するように配置した後、セラミックス基板１０と銅板１６との間に０．００５〜０．５ｋｇｆ／ｃｍ２の荷重を加えながら７８０〜８９０℃で加熱してセラミックス基板１０に銅板１６を接合する。【選択図】図２
METAL-CERAMIC BONDING BOARD AND MANUFACTURING METHOD THEREOF
To provide a metal-ceramic bonding board and a manufacturing method thereof, capable of satisfactorily bonding a copper plate to a ceramic substrate even when heated at a low temperature while applying a conventionally low load.SOLUTION: The present invention provides a manufacturing method of a metal-ceramic bonding board in which an active metal material 12 containing only an active metal as a metal component and a brazing material 14 containing only a metal other than the active metal as a metal component and containing P are prepared, a ratio of mass of the metal component of the active metal material 12 to total mass of the metal component of the active metal material 12 and the metal component and P of the brazing material 14 is regulated in 5 mass% or less, the active metal material 12 is arranged on one surface of a ceramic substrate 10, the brazing material 14 is arranged on one surface of a copper plate 16, and the ceramic substrate 10 and the copper plate 16 are arranged so that the active metal material 12 and the brazing material 14 are contacted, and subsequently the copper plate 16 is joined to the ceramic substrate 10 by heating at 780 to 890°C while applying a load of 0.005 to 0.5 kgf/cm2 between the ceramic substrate 10 and the copper plate 16.SELECTED DRAWING: Figure 2
【課題】従来よりも低い荷重を加えながら低い温度で加熱しても、銅板をセラミックス基板に良好に接合することができる、金属−セラミックス接合基板およびその製造方法を提供する。【解決手段】金属成分として活性金属のみを含む活性金属材１２と、金属成分として活性金属以外の金属のみを含み且つＰを含むろう材１４を用意し、活性金属材１２の金属成分とろう材１４の金属成分およびＰとの合計の質量に対する活性金属材１２の金属成分の質量の割合を５質量％以下として、セラミックス基板１０の一方の面に活性金属材１２を配置するとともに、銅板１６の一方の面にろう材１４を配置し、セラミックス基板１０と銅板１６とを、活性金属材１２とろう材１４が当接するように配置した後、セラミックス基板１０と銅板１６との間に０．００５〜０．５ｋｇｆ／ｃｍ２の荷重を加えながら７８０〜８９０℃で加熱してセラミックス基板１０に銅板１６を接合する。【選択図】図２
METAL-CERAMIC BONDING BOARD AND MANUFACTURING METHOD THEREOF
金属−セラミックス接合基板およびその製造方法
TERAMOTO YUKI (author) / KOBAYASHI KOJI (author)
2021-05-20
Patent
Electronic Resource
Japanese
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