A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC CONJUGATE, AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic conjugate having high bonding strength and especially excellent in cold-heat cycle reliability, and to provide an insulated circuit board.SOLUTION: A copper/ceramic conjugate 10 is formed by joining a copper member 12 comprising copper or a copper alloy with a ceramic member 11 comprising an aluminum-containing ceramics, wherein at a boundary surface where the copper member and the ceramic members are joined, an active metal compound layer 41 is formed on a side of the ceramic member, the compound layer containing a compound comprising one or more active metals selected from Ti, Zr, Nb and Hf. Al and Cu exist on a grain boundary of the active metal compound in the active metal compound layer.SELECTED DRAWING: Figure 2
【課題】接合強度が高く、かつ、冷熱サイクル信頼性に特に優れた銅／セラミックス接合体、及び、絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、アルミニウム含有セラミックスからなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、前記銅部材と前記セラミックス部材との接合界面においては、前記セラミックス部材側に、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属の化合物を含む活性金属化合物層４１が形成されており、この活性金属化合物層においては、活性金属化合物の粒界にＡｌ及びＣｕが存在していることを特徴とする。【選択図】図２
COPPER/CERAMIC CONJUGATE, AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic conjugate having high bonding strength and especially excellent in cold-heat cycle reliability, and to provide an insulated circuit board.SOLUTION: A copper/ceramic conjugate 10 is formed by joining a copper member 12 comprising copper or a copper alloy with a ceramic member 11 comprising an aluminum-containing ceramics, wherein at a boundary surface where the copper member and the ceramic members are joined, an active metal compound layer 41 is formed on a side of the ceramic member, the compound layer containing a compound comprising one or more active metals selected from Ti, Zr, Nb and Hf. Al and Cu exist on a grain boundary of the active metal compound in the active metal compound layer.SELECTED DRAWING: Figure 2
【課題】接合強度が高く、かつ、冷熱サイクル信頼性に特に優れた銅／セラミックス接合体、及び、絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、アルミニウム含有セラミックスからなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、前記銅部材と前記セラミックス部材との接合界面においては、前記セラミックス部材側に、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属の化合物を含む活性金属化合物層４１が形成されており、この活性金属化合物層においては、活性金属化合物の粒界にＡｌ及びＣｕが存在していることを特徴とする。【選択図】図２
COPPER/CERAMIC CONJUGATE, AND INSULATED CIRCUIT BOARD
銅／セラミックス接合体、及び、絶縁回路基板
TERASAKI NOBUYUKI (author)
2021-06-24
Patent
Electronic Resource
Japanese
| European Patent Office | 2021