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A platform for research: civil engineering, architecture and urbanism
MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE
To protect an adhesive material for adhering a ceramic heater and a metal base to each other with a protection material and prevent the generation of failure caused by the thermal expansion difference between the adhesive material and the protection material.SOLUTION: A focus ring (FR) mounting stage 20 as a member for a semiconductor manufacturing device comprises: an annular FR ceramic heater 22; a FR cooling board 24 as a metal base; an adhesive sheet 25 that is an adhesive material for adhering the FR cooling board 24 and the FR ceramic heater 22 to each other; and adhesive inner peripheral side and outer peripheral side protection materials 27i and 27o provided between the FR ceramic heater 22 and the FR cooling board 24 so as to surround the circumference of the adhesive sheet 25. An inner peripheral side gap layer 28i is provided between the adhesive sheet 25 and the inner peripheral side protection material 27i. An outer peripheral side gap layer 28o is provided between the adhesive sheet 25 and the outer peripheral side protection material 27o.SELECTED DRAWING: Figure 3
【課題】セラミックヒータと金属ベースとを接着する接着材を保護材で保護すると共に接着材と保護材との熱膨張差に起因する不具合の発生を防止する。【解決手段】半導体製造装置用部材であるフォーカスリング（ＦＲ）載置台２０は、円環状のＦＲ用セラミックヒータ２２と、金属ベースであるＦＲ用冷却板２４と、ＦＲ用冷却板２４とＦＲ用セラミックヒータ２２とを接着する接着材である接着シート２５と、接着シート２５の周囲を囲むようにＦＲ用セラミックヒータ２２とＦＲ用冷却板２４との間に設けられた接着性の内周側及び外周側保護材２７ｉ，２７ｏと、を備える。接着シート２５と内周側保護材２７ｉとの間には内周側空隙層２８ｉが設けられている。接着シート２５と外周側保護材２７ｏとの間には外周側空隙層２８ｏが設けられている。【選択図】図３
MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE
To protect an adhesive material for adhering a ceramic heater and a metal base to each other with a protection material and prevent the generation of failure caused by the thermal expansion difference between the adhesive material and the protection material.SOLUTION: A focus ring (FR) mounting stage 20 as a member for a semiconductor manufacturing device comprises: an annular FR ceramic heater 22; a FR cooling board 24 as a metal base; an adhesive sheet 25 that is an adhesive material for adhering the FR cooling board 24 and the FR ceramic heater 22 to each other; and adhesive inner peripheral side and outer peripheral side protection materials 27i and 27o provided between the FR ceramic heater 22 and the FR cooling board 24 so as to surround the circumference of the adhesive sheet 25. An inner peripheral side gap layer 28i is provided between the adhesive sheet 25 and the inner peripheral side protection material 27i. An outer peripheral side gap layer 28o is provided between the adhesive sheet 25 and the outer peripheral side protection material 27o.SELECTED DRAWING: Figure 3
【課題】セラミックヒータと金属ベースとを接着する接着材を保護材で保護すると共に接着材と保護材との熱膨張差に起因する不具合の発生を防止する。【解決手段】半導体製造装置用部材であるフォーカスリング（ＦＲ）載置台２０は、円環状のＦＲ用セラミックヒータ２２と、金属ベースであるＦＲ用冷却板２４と、ＦＲ用冷却板２４とＦＲ用セラミックヒータ２２とを接着する接着材である接着シート２５と、接着シート２５の周囲を囲むようにＦＲ用セラミックヒータ２２とＦＲ用冷却板２４との間に設けられた接着性の内周側及び外周側保護材２７ｉ，２７ｏと、を備える。接着シート２５と内周側保護材２７ｉとの間には内周側空隙層２８ｉが設けられている。接着シート２５と外周側保護材２７ｏとの間には外周側空隙層２８ｏが設けられている。【選択図】図３
MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE
半導体製造装置用部材
INOUE SEIYA (author) / KUNO TATSUYA (author)
2022-12-22
Patent
Electronic Resource
Japanese
| European Patent Office | 2025
| European Patent Office | 2022
| European Patent Office | 2021