A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
MANUFACTURING METHOD OF INSULATION CIRCUIT BOARD
To provide a manufacturing method of an insulation circuit board capable of suppressing positional displacement.SOLUTION: The present invention relates to a manufacturing method of an insulation circuit board configured by bonding in a laminated state a first metal plate and a second metal plate on a surface of a ceramic substrate. The manufacturing method includes: a punching step of performing punching molding on the second metal plate through pressing work, forming the second metal plate whose plane size is smaller than that of the first metal plate, and forming burrs at an outer peripheral edge of the second metal plate; a first bonding step of bonding the first metal plate to the ceramic substrate; and a second bonding step of bonding the first metal plate and the second metal plate by heating them while pressing them, after the first bonding step, in a state where the outer peripheral edge of the second metal plate is settled within a surface of the first metal plate at an opposite side of the ceramic substrate and the burrs of the second metal plate bite in.SELECTED DRAWING: Figure 2
【課題】位置ずれを抑制できる絶縁回路基板の製造方法を提供すること。【解決手段】セラミックス基板の表面に第１金属板及び第２金属板が積層状態で接合されてなる絶縁回路基板の製造方法であって、第２金属板をプレス加工により打ち抜き成形して第１金属板より平面サイズが小さい第２金属板を形成するとともに、第２金属板の外周縁にバリを形成する打ち抜き工程と、セラミックス基板に第１金属板を接合する第１接合工程と、第１接合工程後に、第１金属板のセラミックス基板とは反対側の面内に第２金属板の外周縁が収まり、かつ、第２金属板のバリを食い込ませた状態で加圧しながら加熱して第１金属板及び第２金属板を接合する第２接合工程と、を備える。【選択図】図２
MANUFACTURING METHOD OF INSULATION CIRCUIT BOARD
To provide a manufacturing method of an insulation circuit board capable of suppressing positional displacement.SOLUTION: The present invention relates to a manufacturing method of an insulation circuit board configured by bonding in a laminated state a first metal plate and a second metal plate on a surface of a ceramic substrate. The manufacturing method includes: a punching step of performing punching molding on the second metal plate through pressing work, forming the second metal plate whose plane size is smaller than that of the first metal plate, and forming burrs at an outer peripheral edge of the second metal plate; a first bonding step of bonding the first metal plate to the ceramic substrate; and a second bonding step of bonding the first metal plate and the second metal plate by heating them while pressing them, after the first bonding step, in a state where the outer peripheral edge of the second metal plate is settled within a surface of the first metal plate at an opposite side of the ceramic substrate and the burrs of the second metal plate bite in.SELECTED DRAWING: Figure 2
【課題】位置ずれを抑制できる絶縁回路基板の製造方法を提供すること。【解決手段】セラミックス基板の表面に第１金属板及び第２金属板が積層状態で接合されてなる絶縁回路基板の製造方法であって、第２金属板をプレス加工により打ち抜き成形して第１金属板より平面サイズが小さい第２金属板を形成するとともに、第２金属板の外周縁にバリを形成する打ち抜き工程と、セラミックス基板に第１金属板を接合する第１接合工程と、第１接合工程後に、第１金属板のセラミックス基板とは反対側の面内に第２金属板の外周縁が収まり、かつ、第２金属板のバリを食い込ませた状態で加圧しながら加熱して第１金属板及び第２金属板を接合する第２接合工程と、を備える。【選択図】図２
MANUFACTURING METHOD OF INSULATION CIRCUIT BOARD
絶縁回路基板の製造方法
YUMOTO RYOHEI (author) / AKIBA KEISHU (author) / KITAHARA JOJI (author)
2021-10-07
Patent
Electronic Resource
Japanese
| European Patent Office | 2020