A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
MANUFACTURING METHOD OF INSULATION CIRCUIT BOARD
To provide a manufacturing method of an insulation circuit board which stably prints a bonding paste on a first surface and a second surface of a ceramic board and stably manufactures the insulation circuit board.SOLUTION: A method includes a bonding paste printing step of printing a bonding paste on a first surface and a second surface of a ceramic board 11. The method also includes printing the bonding paste on the first surface of the ceramic board, inverting the ceramic board, placing the board on a printing stage 50 in which there is a recess part 52 on a mounting surface, and printing the bonding paste 25 on the second surface of the ceramic board in such a state that the bonding paste 25 printed on the first surface is stored in the recess part and the ceramic board is fixed by a suction part 55.SELECTED DRAWING: Figure 5
【課題】セラミックス基板の第一の面及び第二の面に接合用ペーストを安定して印刷し、絶縁回路基板を安定して製造する絶縁回路基板の製造方法を提供する。【解決手段】方法は、セラミックス基板１１の第一の面及び第二の面にそれぞれ接合用ペーストを印刷する接合用ペースト印刷工程を有し、セラミックス基板の第一の面に接合用ペーストを印刷し、その後、セラミックス基板を反転し、載置面に凹部５２を有する印刷ステージ５０に載置し、第一の面に印刷された接合用ペースト２５が凹部内に収容されるとともに、吸引部５５によってセラミックス基板が固定された状態で、セラミックス基板の第二の面に接合用ペースト２５を印刷する。【選択図】図５
MANUFACTURING METHOD OF INSULATION CIRCUIT BOARD
To provide a manufacturing method of an insulation circuit board which stably prints a bonding paste on a first surface and a second surface of a ceramic board and stably manufactures the insulation circuit board.SOLUTION: A method includes a bonding paste printing step of printing a bonding paste on a first surface and a second surface of a ceramic board 11. The method also includes printing the bonding paste on the first surface of the ceramic board, inverting the ceramic board, placing the board on a printing stage 50 in which there is a recess part 52 on a mounting surface, and printing the bonding paste 25 on the second surface of the ceramic board in such a state that the bonding paste 25 printed on the first surface is stored in the recess part and the ceramic board is fixed by a suction part 55.SELECTED DRAWING: Figure 5
【課題】セラミックス基板の第一の面及び第二の面に接合用ペーストを安定して印刷し、絶縁回路基板を安定して製造する絶縁回路基板の製造方法を提供する。【解決手段】方法は、セラミックス基板１１の第一の面及び第二の面にそれぞれ接合用ペーストを印刷する接合用ペースト印刷工程を有し、セラミックス基板の第一の面に接合用ペーストを印刷し、その後、セラミックス基板を反転し、載置面に凹部５２を有する印刷ステージ５０に載置し、第一の面に印刷された接合用ペースト２５が凹部内に収容されるとともに、吸引部５５によってセラミックス基板が固定された状態で、セラミックス基板の第二の面に接合用ペースト２５を印刷する。【選択図】図５
MANUFACTURING METHOD OF INSULATION CIRCUIT BOARD
絶縁回路基板の製造方法
SAKURAI AKIRA (author) / TERASAKI NOBUYUKI (author) / GOMYO MIKA (author)
2023-06-09
Patent
Electronic Resource
Japanese
| European Patent Office | 2020