A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COMPOSITE SINTERED BODY, SEMICONDUCTOR MANUFACTURING DEVICE MEMBER, AND MANUFACTURING METHOD OF COMPOSITE SINTERED BODY
To suppress uneven distribution of ZrO2 in an electrode.SOLUTION: A composite sintered body 20 includes a base material containing Al2O3 as a main material, and an electrode 23 arranged inside or on a surface of the base material. The electrode 23 includes Ru, ZrO2, and Al2O3. Thereby, uneven distribution of ZrO2 in the electrode 23 can be suppressed. As a result, cracks in the base material and peeling of the electrode 23 caused by a difference in a thermal expansion coefficient between the electrode 23 and the base material due to an influence of the uneven distribution can be suppressed.SELECTED DRAWING: Figure 1
【課題】電極中におけるＺｒＯ２の偏在を抑制する。【解決手段】複合焼結体２０は、Ａｌ２Ｏ３を主材料とする基材と、当該基材の内部または表面に配置される電極２３と、を備える。電極２３は、Ｒｕと、ＺｒＯ２と、Ａｌ２Ｏ３とを含む。これにより、電極２３中におけるＺｒＯ２の偏在を抑制することができる。その結果、当該偏在の影響による電極２３と基材との熱膨張係数の差に起因する基材のクラックや電極２３の剥離を抑制することができる。【選択図】図１
COMPOSITE SINTERED BODY, SEMICONDUCTOR MANUFACTURING DEVICE MEMBER, AND MANUFACTURING METHOD OF COMPOSITE SINTERED BODY
To suppress uneven distribution of ZrO2 in an electrode.SOLUTION: A composite sintered body 20 includes a base material containing Al2O3 as a main material, and an electrode 23 arranged inside or on a surface of the base material. The electrode 23 includes Ru, ZrO2, and Al2O3. Thereby, uneven distribution of ZrO2 in the electrode 23 can be suppressed. As a result, cracks in the base material and peeling of the electrode 23 caused by a difference in a thermal expansion coefficient between the electrode 23 and the base material due to an influence of the uneven distribution can be suppressed.SELECTED DRAWING: Figure 1
【課題】電極中におけるＺｒＯ２の偏在を抑制する。【解決手段】複合焼結体２０は、Ａｌ２Ｏ３を主材料とする基材と、当該基材の内部または表面に配置される電極２３と、を備える。電極２３は、Ｒｕと、ＺｒＯ２と、Ａｌ２Ｏ３とを含む。これにより、電極２３中におけるＺｒＯ２の偏在を抑制することができる。その結果、当該偏在の影響による電極２３と基材との熱膨張係数の差に起因する基材のクラックや電極２３の剥離を抑制することができる。【選択図】図１
COMPOSITE SINTERED BODY, SEMICONDUCTOR MANUFACTURING DEVICE MEMBER, AND MANUFACTURING METHOD OF COMPOSITE SINTERED BODY
複合焼結体、半導体製造装置部材および複合焼結体の製造方法
MIYANISHI KEITA (author) / ATSUJI KYOHEI (author) / NAGAI ASUMI (author) / YAMAGUCHI HIROFUMI (author) / AOYAGI SOICHIRO (author)
2022-03-25
Patent
Electronic Resource
Japanese
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