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CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, AND METHOD OF MANUFACTURING CERAMIC SUBSTRATE
To provide a ceramic substrate capable of improving the removal rate of an unnecessary brazing material while ensuring the bonding strength with a metal circuit or a metal heat sink.SOLUTION: A ceramic substrate 1 has a main surface 1a and a main surface 1b, and the surface roughness Ra1 of the main surface 1a is 0.50 μm or less, the surface roughness Ra2 of the main surface 1b is 0.50 μm or more, and the surface roughness Ra2 is greater than the surface roughness Ra1 by 0.10 μm or more.SELECTED DRAWING: Figure 1
【課題】金属回路や金属放熱板との接合強度を確保しながら、不要なろう材の除去率を向上させることができるセラミックス基板を提供する。【解決手段】主面１ａおよび主面１ｂを有するセラミックス基板１であって、主面１ａの表面粗さＲａ１が０．５０μｍ以下であり、主面１ｂの表面粗さＲａ２が０．５０μｍ以上であり、表面粗さＲａ２は、表面粗さＲａ１よりも０．１０μｍ以上大きいセラミックス基板１。【選択図】図１
CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, AND METHOD OF MANUFACTURING CERAMIC SUBSTRATE
To provide a ceramic substrate capable of improving the removal rate of an unnecessary brazing material while ensuring the bonding strength with a metal circuit or a metal heat sink.SOLUTION: A ceramic substrate 1 has a main surface 1a and a main surface 1b, and the surface roughness Ra1 of the main surface 1a is 0.50 μm or less, the surface roughness Ra2 of the main surface 1b is 0.50 μm or more, and the surface roughness Ra2 is greater than the surface roughness Ra1 by 0.10 μm or more.SELECTED DRAWING: Figure 1
【課題】金属回路や金属放熱板との接合強度を確保しながら、不要なろう材の除去率を向上させることができるセラミックス基板を提供する。【解決手段】主面１ａおよび主面１ｂを有するセラミックス基板１であって、主面１ａの表面粗さＲａ１が０．５０μｍ以下であり、主面１ｂの表面粗さＲａ２が０．５０μｍ以上であり、表面粗さＲａ２は、表面粗さＲａ１よりも０．１０μｍ以上大きいセラミックス基板１。【選択図】図１
CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, AND METHOD OF MANUFACTURING CERAMIC SUBSTRATE
セラミックス基板、セラミックス回路基板およびセラミックス基板の製造方法
KAGA YOICHIRO (author) / FUKUMOTO REI (author) / IMAMURA TOSHIYUKI (author)
2023-04-11
Patent
Electronic Resource
Japanese
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