A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CERAMIC SCRIBE SUBSTRATE, CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SCRIBE SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT
A ceramic scribe substrate according to the present embodiment includes a continuous groove having multiple grooves connected to each other formed by fiber laser irradiation on a surface portion of a scribe line shaping a ceramic substrate. The continuous groove has a depth of more than 50 um within a range of 0.15 times or more and 0.55 times or less a thickness of the ceramic substrate.
CERAMIC SCRIBE SUBSTRATE, CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SCRIBE SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT
A ceramic scribe substrate according to the present embodiment includes a continuous groove having multiple grooves connected to each other formed by fiber laser irradiation on a surface portion of a scribe line shaping a ceramic substrate. The continuous groove has a depth of more than 50 um within a range of 0.15 times or more and 0.55 times or less a thickness of the ceramic substrate.
CERAMIC SCRIBE SUBSTRATE, CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SCRIBE SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT
KERAMISCHES RITZSUBSTRAT, KERAMISCHES SUBSTRAT, VERFAHREN ZUR HERSTELLUNG DES KERAMISCHEN RITZSUBSTRATS, VERFAHREN ZUR HERSTELLUNG DER KERAMISCHEN LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG
SUBSTRAT DE DÉCOUPE CÉRAMIQUE, SUBSTRAT CÉRAMIQUE, PROCÉDÉ DE FABRICATION DE SUBSTRAT DE DÉCOUPE CÉRAMIQUE, PROCÉDÉ DE FABRICATION DE SUBSTRAT CÉRAMIQUE, PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ CÉRAMIQUE, ET PROCÉDÉ DE FABRICATION D'ÉLÉMENT SEMI-CONDUCTEUR
MATSUMOTO YUKIHISA (author) / HOSHINO NAOTO (author)
2024-12-04
Patent
Electronic Resource
English
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