A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic bonded body that can suppress the occurrence of cracking and peeling of a ceramic member even when a severe thermal cycle has been loaded thereon, and is excellent in thermal cycle reliability.SOLUTION: A Cu member 12 is bonded to at least one surface of a ceramic member 11; on a surface of the Cu member 12 opposite to the surface bonded to the ceramic member 11, a convex R-shaped portion 12a which is convex outward is formed at an end portion of the copper member 12, and a width w of the convex R-shaped portion 12a is controlled to a range of 50 μm or longer and 600 μm or shorter from the end portion; and on a bonding interface between the ceramic member 11 and the Cu member 12, an Ag-Cu alloy layer is formed on the Cu member 12 side, and a ratio te/tc of the thicknesses te of the Ag-Cu alloy layer in the end region of the Cu member 12 to the thicknesses tc of the Ag-Cu alloy layer in the central region of the Cu member 12 is controlled to a range of 1.3 or larger and 3.0 or smaller.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材の割れや剥離の発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】セラミックス部材１１の少なくとも一方の面に銅部材１２が接合されており、銅部材１２のセラミックス部材１１との接合面とは反対側の面において、銅部材１２の端部には、外方に向けて凸となる凸Ｒ形状部１２ａが形成され、この凸Ｒ形状部１２ａの幅ｗが端部から５０μｍ以上６００μｍ以下の範囲内とされており、セラミックス部材１１と銅部材１２との接合界面において、銅部材１２側にはＡｇ－Ｃｕ合金層が形成されており、銅部材１２の端部領域における前記Ａｇ－Ｃｕ合金層の厚さｔｅと、銅部材１２の中央部領域における前記Ａｇ－Ｃｕ合金層の厚さｔｃとの比ｔｅ／ｔｃが１．３以上３．０以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic bonded body that can suppress the occurrence of cracking and peeling of a ceramic member even when a severe thermal cycle has been loaded thereon, and is excellent in thermal cycle reliability.SOLUTION: A Cu member 12 is bonded to at least one surface of a ceramic member 11; on a surface of the Cu member 12 opposite to the surface bonded to the ceramic member 11, a convex R-shaped portion 12a which is convex outward is formed at an end portion of the copper member 12, and a width w of the convex R-shaped portion 12a is controlled to a range of 50 μm or longer and 600 μm or shorter from the end portion; and on a bonding interface between the ceramic member 11 and the Cu member 12, an Ag-Cu alloy layer is formed on the Cu member 12 side, and a ratio te/tc of the thicknesses te of the Ag-Cu alloy layer in the end region of the Cu member 12 to the thicknesses tc of the Ag-Cu alloy layer in the central region of the Cu member 12 is controlled to a range of 1.3 or larger and 3.0 or smaller.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材の割れや剥離の発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】セラミックス部材１１の少なくとも一方の面に銅部材１２が接合されており、銅部材１２のセラミックス部材１１との接合面とは反対側の面において、銅部材１２の端部には、外方に向けて凸となる凸Ｒ形状部１２ａが形成され、この凸Ｒ形状部１２ａの幅ｗが端部から５０μｍ以上６００μｍ以下の範囲内とされており、セラミックス部材１１と銅部材１２との接合界面において、銅部材１２側にはＡｇ－Ｃｕ合金層が形成されており、銅部材１２の端部領域における前記Ａｇ－Ｃｕ合金層の厚さｔｅと、銅部材１２の中央部領域における前記Ａｇ－Ｃｕ合金層の厚さｔｃとの比ｔｅ／ｔｃが１．３以上３．０以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
銅／セラミックス接合体、および、絶縁回路基板
NISHIMOTO SHUJI (author) / TAKAKUWA SATOSHI (author)
2023-05-16
Patent
Electronic Resource
Japanese