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    SPUTTERING TARGET MEMBER SPUTTERING TARGET ASSEMBLY AND MANUFACTURING METHOD OF SPUTTERING TARGET MEMBER

    [과제] 본 발명은 타깃재의 기계적 강도의 저하를 억제하면서, 배킹 부재와의 접합이 가능한 스퍼터링 타깃 부재, 및 이러한 스퍼터링 타깃 부재를 구비하는 스퍼터링 타깃 조립체, 및 스퍼터링 타깃 부재의 제조 방법을 제공하는 것을 과제로 한다. [해결 수단] 산화물 세라믹 소결체로 이루어지는 타깃재와, 상기 타깃재의 적어도 일방의 표면에 In-Ni 합금으로 이루어지는 기초층과, 인듐을 50질량% 이상 함유하는 접합층을 순서대로 구비하는 스퍼터링 타깃 부재.

    The present invention provides a sputtering target member which can be bonded to a backing member while suppressing the decrease in the mechanical strength of a target material, a sputtering target assembly including the sputtering target member, and a manufacturing method of the sputtering target member. The sputtering target member includes a target material made of an oxide ceramic sintered body, a base layer made of In-Ni alloy on at least one surface of the target material, and a bonding layer containing more than 50 mass% of indium in order.

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    SPUTTERING TARGET MEMBER SPUTTERING TARGET ASSEMBLY AND MANUFACTURING METHOD OF SPUTTERING TARGET MEMBER

    [과제] 본 발명은 타깃재의 기계적 강도의 저하를 억제하면서, 배킹 부재와의 접합이 가능한 스퍼터링 타깃 부재, 및 이러한 스퍼터링 타깃 부재를 구비하는 스퍼터링 타깃 조립체, 및 스퍼터링 타깃 부재의 제조 방법을 제공하는 것을 과제로 한다. [해결 수단] 산화물 세라믹 소결체로 이루어지는 타깃재와, 상기 타깃재의 적어도 일방의 표면에 In-Ni 합금으로 이루어지는 기초층과, 인듐을 50질량% 이상 함유하는 접합층을 순서대로 구비하는 스퍼터링 타깃 부재.

    The present invention provides a sputtering target member which can be bonded to a backing member while suppressing the decrease in the mechanical strength of a target material, a sputtering target assembly including the sputtering target member, and a manufacturing method of the sputtering target member. The sputtering target member includes a target material made of an oxide ceramic sintered body, a base layer made of In-Ni alloy on at least one surface of the target material, and a bonding layer containing more than 50 mass% of indium in order.

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    SPUTTERING TARGET MEMBER SPUTTERING TARGET ASSEMBLY AND MANUFACTURING METHOD OF SPUTTERING TARGET MEMBER

    [과제] 본 발명은 타깃재의 기계적 강도의 저하를 억제하면서, 배킹 부재와의 접합이 가능한 스퍼터링 타깃 부재, 및 이러한 스퍼터링 타깃 부재를 구비하는 스퍼터링 타깃 조립체, 및 스퍼터링 타깃 부재의 제조 방법을 제공하는 것을 과제로 한다. [해결 수단] 산화물 세라믹 소결체로 이루어지는 타깃재와, 상기 타깃재의 적어도 일방의 표면에 In-Ni 합금으로 이루어지는 기초층과, 인듐을 50질량% 이상 함유하는 접합층을 순서대로 구비하는 스퍼터링 타깃 부재.

    The present invention provides a sputtering target member which can be bonded to a backing member while suppressing the decrease in the mechanical strength of a target material, a sputtering target assembly including the sputtering target member, and a manufacturing method of the sputtering target member. The sputtering target member includes a target material made of an oxide ceramic sintered body, a base layer made of In-Ni alloy on at least one surface of the target material, and a bonding layer containing more than 50 mass% of indium in order.

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    Title:

    SPUTTERING TARGET MEMBER SPUTTERING TARGET ASSEMBLY AND MANUFACTURING METHOD OF SPUTTERING TARGET MEMBER

    Additional title:

    스퍼터링 타깃 부재, 스퍼터링 타깃 조립체 및 스퍼터링 타깃 부재의 제조 방법

    Publication date:

    2021-06-22

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    Korean

    Classification:

    IPC:  C23C Beschichten metallischer Werkstoffe , COATING METALLIC MATERIAL / C04B Kalk , LIME / H01J Elektrische Entladungsröhren oder Entladungslampen , ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS

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