A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
FLOOR MATERIAL IMPROVED SOUND INSULATION AND THERMAL CONDUCTIVITY
The present invention relates to a floor material having a covering-paper layer and a foaming layer from the top thereof. According to the floor material, a plurality of holes are formed at constant intervals on the foaming layer, and a thermal conductive filler is filled in the holes. The thermal conductive filler is capable of containing one or more organic resin powder selected from a group composed of a polyurethane-based resin, a silicon-based resin, a polyethylene-based resin, a polypropylene-based resin, a polymethylpentene-based resin, a polyacrylic resin, a polystyrene-based resin, and a polyfluoro-based resin.
본 발명은 위로부터 표지층 및 발포층을 포함하는 바닥재에 있어서, 상기 발포층에 다수개의 구멍이 일정 간격으로 형성되고, 상기 구멍에 열전도성 충전제가 채워진 것을 특징으로 하는 바닥재에 관한 것이다.
FLOOR MATERIAL IMPROVED SOUND INSULATION AND THERMAL CONDUCTIVITY
The present invention relates to a floor material having a covering-paper layer and a foaming layer from the top thereof. According to the floor material, a plurality of holes are formed at constant intervals on the foaming layer, and a thermal conductive filler is filled in the holes. The thermal conductive filler is capable of containing one or more organic resin powder selected from a group composed of a polyurethane-based resin, a silicon-based resin, a polyethylene-based resin, a polypropylene-based resin, a polymethylpentene-based resin, a polyacrylic resin, a polystyrene-based resin, and a polyfluoro-based resin.
본 발명은 위로부터 표지층 및 발포층을 포함하는 바닥재에 있어서, 상기 발포층에 다수개의 구멍이 일정 간격으로 형성되고, 상기 구멍에 열전도성 충전제가 채워진 것을 특징으로 하는 바닥재에 관한 것이다.
FLOOR MATERIAL IMPROVED SOUND INSULATION AND THERMAL CONDUCTIVITY
차음성능 및 열전도성능이 향상된 바닥재
KIM JUN YUP (author)
2015-12-03
Patent
Electronic Resource
Korean
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
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