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Floor material with improved thermal conductivity
The present invention relates to a floor material with improved thermal conductivity, which comprises: a base material layer; a surface layer arranged in an upper portion of the base material layer; a lower layer arranged in a lower portion of the base material layer; and a thermal conductivity sheet interposed between the surface layer and the lower layer. Moreover, the thermal conductivity sheet is arranged to prevent the sheet from coming in contact with floor slab.
본 발명은 열전도율이 향상된 바닥재에 관한 것으로, 기재층과; 이 기재층 상부에 배치된 표면층; 기재층 하부에 배치된 하부층; 및 표면층과 하부층 사이에 개재되는 열전도성 시트;로 이루어지는데, 열전도성 시트가 바닥 슬래브와 접촉되지 않게 배치하도록 한다.
Floor material with improved thermal conductivity
The present invention relates to a floor material with improved thermal conductivity, which comprises: a base material layer; a surface layer arranged in an upper portion of the base material layer; a lower layer arranged in a lower portion of the base material layer; and a thermal conductivity sheet interposed between the surface layer and the lower layer. Moreover, the thermal conductivity sheet is arranged to prevent the sheet from coming in contact with floor slab.
본 발명은 열전도율이 향상된 바닥재에 관한 것으로, 기재층과; 이 기재층 상부에 배치된 표면층; 기재층 하부에 배치된 하부층; 및 표면층과 하부층 사이에 개재되는 열전도성 시트;로 이루어지는데, 열전도성 시트가 바닥 슬래브와 접촉되지 않게 배치하도록 한다.
Floor material with improved thermal conductivity
열전도율이 향상된 바닥재
CHO DO YOUNG (author)
2018-02-26
Patent
Electronic Resource
Korean
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
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