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Adhesive Composition and Ceiling Board using the Same
The present invention relates to an adhesive composition which has improved fire safety performance while having excellent adhesion, and a ceiling material applied therewith. The adhesive composition of the present invention comprises: 15 to 30 wt% of an inorganic adhesive material; 15 to 45 wt% of an organic adhesive material; and 30 to 65 wt% of water.
본 발명은 무기계 접착성 물질, 유기계 접착성 물질 및 물을 포함하는 접착제 조성물에 관한 것으로 접착력과 화재 안전 성능이 우수한 천장재를 제공한다.
Adhesive Composition and Ceiling Board using the Same
The present invention relates to an adhesive composition which has improved fire safety performance while having excellent adhesion, and a ceiling material applied therewith. The adhesive composition of the present invention comprises: 15 to 30 wt% of an inorganic adhesive material; 15 to 45 wt% of an organic adhesive material; and 30 to 65 wt% of water.
본 발명은 무기계 접착성 물질, 유기계 접착성 물질 및 물을 포함하는 접착제 조성물에 관한 것으로 접착력과 화재 안전 성능이 우수한 천장재를 제공한다.
Adhesive Composition and Ceiling Board using the Same
접착제 조성물 및 이를 적용한 천장재
SONG MIN WOOK (author) / DAN JUNG HYUN (author) / LEE NAM SU (author) / KIM DONG LAE (author)
2019-04-30
Patent
Electronic Resource
Korean
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