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FLAME RETARDANT ADHESIVE COMPOSITION AND CEILING BOARD COMPRISING SAME
The present invention relates to: a flame retardant adhesive composition comprising 20 to 50 wt% of colloidal silica, 5 to 20 wt% of polyvinyl alcohol, 20 to 50 wt% of an inorganic flame retardant, and 0.1 to 10 wt% of a coupling agent, based on the total weight of the solid content; and a non-combustible ceiling board comprising same.
La présente invention concerne : une composition adhésive ignifuge comprenant de 20 à 50 % en poids de silice colloïdale, de 5 à 20 % en poids d'alcool polyvinylique, de 20 à 50 % en poids d'un retardateur de flamme inorganique, et de 0,1 à 10 % en poids d'un agent de couplage, sur la base du poids total de la teneur en solides ; et un panneau de plafond non combustible la comprenant.
본 발명은 고형분 총 중량을 기준으로 20 내지 50 중량%의 콜로이달 실리카, 5 내지 20 중량%의 폴리비닐알코올, 20 내지 50 중량%의 무기 난연제 및 0.1 내지 10 중량%의 커플링제를 포함하는 난연 접착제 조성물, 및 이를 포함하는 불연성을 갖는 천장재에 관한 것이다.
FLAME RETARDANT ADHESIVE COMPOSITION AND CEILING BOARD COMPRISING SAME
The present invention relates to: a flame retardant adhesive composition comprising 20 to 50 wt% of colloidal silica, 5 to 20 wt% of polyvinyl alcohol, 20 to 50 wt% of an inorganic flame retardant, and 0.1 to 10 wt% of a coupling agent, based on the total weight of the solid content; and a non-combustible ceiling board comprising same.
La présente invention concerne : une composition adhésive ignifuge comprenant de 20 à 50 % en poids de silice colloïdale, de 5 à 20 % en poids d'alcool polyvinylique, de 20 à 50 % en poids d'un retardateur de flamme inorganique, et de 0,1 à 10 % en poids d'un agent de couplage, sur la base du poids total de la teneur en solides ; et un panneau de plafond non combustible la comprenant.
본 발명은 고형분 총 중량을 기준으로 20 내지 50 중량%의 콜로이달 실리카, 5 내지 20 중량%의 폴리비닐알코올, 20 내지 50 중량%의 무기 난연제 및 0.1 내지 10 중량%의 커플링제를 포함하는 난연 접착제 조성물, 및 이를 포함하는 불연성을 갖는 천장재에 관한 것이다.
FLAME RETARDANT ADHESIVE COMPOSITION AND CEILING BOARD COMPRISING SAME
COMPOSITION ADHÉSIVE IGNIFUGE ET PANNEAU DE PLAFOND LA COMPRENANT
난연 접착제 조성물, 및 이를 포함하는 천장재
KANG HYEJIN (author) / CHAE MINSUNG (author) / LEE HAESUNG (author) / KIM YUBAE (author) / LEE NAMSU (author) / PARK JONGYUN (author) / LIM TAEWOOK (author) / CHOI SEUNGYEOB (author) / LEE JAEWOOK (author)
2024-08-29
Patent
Electronic Resource
Korean
IPC:
C09J
ADHESIVES
,
Klebstoffe
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
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