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Vibration damping material structure comprising vibration damping material and vibration damping material constructing method
The present invention relates to a vibration damping material, a structure having a vibration damping material and a method for constructing a vibration damping material and, more specifically, to a vibration damping material injected into or attached to a structure, a structure into which a vibration damping material is injected or is attached to a surface, and a construction method for injecting or attaching a vibration damping material to a structure. According to the present invention, provided is the structure for damping vibration transfer by injecting the vibration damping material into the structure or attaching the same to the surface of the structure, the construction method for injecting or attaching a vibration damping material into a structure, and the vibration damping material, wherein the structure is used for supporting semiconductor equipment.
본 발명은 진동감쇠재, 진동감쇠재를 구비하는 구조물 및, 진동감쇠재 시공 방법에 관한 것으로서, 더욱 상세하게는, 구조물에 주입 또는 점착시키는 진동감쇠재와, 진동감쇠재가 내부에 주입되거나 표면에 점착된 구조물 및, 진동감쇠재를 구조물에 주입 또는 점착시키는 시공 방법에 관한 것이다. 본 발명에 의하면, 반도체 장비의 지지 등에 사용되는 구조물에 있어서, 진동감쇠재를 구조물에 주입 또는 구조물 표면에 점착시킴으로써 진동 전달을 감쇠시킨 구조물 및, 진동감쇠재를 구조물에 주입하거나 또는 점착시키는 시공 방법, 그리고 그러한 진동감쇠재를 제공한다.
Vibration damping material structure comprising vibration damping material and vibration damping material constructing method
The present invention relates to a vibration damping material, a structure having a vibration damping material and a method for constructing a vibration damping material and, more specifically, to a vibration damping material injected into or attached to a structure, a structure into which a vibration damping material is injected or is attached to a surface, and a construction method for injecting or attaching a vibration damping material to a structure. According to the present invention, provided is the structure for damping vibration transfer by injecting the vibration damping material into the structure or attaching the same to the surface of the structure, the construction method for injecting or attaching a vibration damping material into a structure, and the vibration damping material, wherein the structure is used for supporting semiconductor equipment.
본 발명은 진동감쇠재, 진동감쇠재를 구비하는 구조물 및, 진동감쇠재 시공 방법에 관한 것으로서, 더욱 상세하게는, 구조물에 주입 또는 점착시키는 진동감쇠재와, 진동감쇠재가 내부에 주입되거나 표면에 점착된 구조물 및, 진동감쇠재를 구조물에 주입 또는 점착시키는 시공 방법에 관한 것이다. 본 발명에 의하면, 반도체 장비의 지지 등에 사용되는 구조물에 있어서, 진동감쇠재를 구조물에 주입 또는 구조물 표면에 점착시킴으로써 진동 전달을 감쇠시킨 구조물 및, 진동감쇠재를 구조물에 주입하거나 또는 점착시키는 시공 방법, 그리고 그러한 진동감쇠재를 제공한다.
Vibration damping material structure comprising vibration damping material and vibration damping material constructing method
진동감쇠재, 진동감쇠재를 구비하는 구조물 및, 진동감쇠재 시공 방법
AN CHAE HUN (author) / RIM KYUNG HWA (author)
2020-08-11
Patent
Electronic Resource
Korean
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
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