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Laminated ceramic sintered body board for electronic device, electronic device, chip resistor, and method for manufacturing chip resistor
A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.
Laminated ceramic sintered body board for electronic device, electronic device, chip resistor, and method for manufacturing chip resistor
A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.
Laminated ceramic sintered body board for electronic device, electronic device, chip resistor, and method for manufacturing chip resistor
NOGUCHI NORIMICHI (author) / MIKAMI MASATERU (author) / TOYOSHIMA KENJI (author) / ODA HIROKI (author) / SUETSUGU DAISUKE (author) / URAKAWA TATSUYA (author)
2023-09-19
Patent
Electronic Resource
English
IPC:
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
H01C
Widerstände
,
RESISTORS
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