A platform for research: civil engineering, architecture and urbanism
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The present invention relates to a chip resistor. A method of manufacturing a chip resistor comprising steps of: preparing an insulating substrate squarely segmented with vertical slits and horizontal slits, applying on the insulating substrate a conductive paste crossing over the horizontal slits, applying a resistor paste on the insulating substrate, forming trimming grooves to adjust resistivity of the resistor layers, and splitting the insulating substrate to form chip resistors, wherein the conductive paste comprises (i) a conductive powder comprising an agglomerated metal powder, wherein particle diameter (D50) of the agglomerated metal powder is 3 to 12 μm and specific surface area (SA) of the agglomerated metal powder is 3.1 to 8.0 m2/g, (ii) a glass frit and (iii) an organic vehicle.
The present invention relates to a chip resistor. A method of manufacturing a chip resistor comprising steps of: preparing an insulating substrate squarely segmented with vertical slits and horizontal slits, applying on the insulating substrate a conductive paste crossing over the horizontal slits, applying a resistor paste on the insulating substrate, forming trimming grooves to adjust resistivity of the resistor layers, and splitting the insulating substrate to form chip resistors, wherein the conductive paste comprises (i) a conductive powder comprising an agglomerated metal powder, wherein particle diameter (D50) of the agglomerated metal powder is 3 to 12 μm and specific surface area (SA) of the agglomerated metal powder is 3.1 to 8.0 m2/g, (ii) a glass frit and (iii) an organic vehicle.
CHIP RESISTOR
TACHIBANA YUSUKE (author)
2018-03-01
Patent
Electronic Resource
English
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