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CYLINDRICAL SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
A cylindrical sputtering target according to the present invention comprises: a metallic cylindrical substrate; and a ceramic cylindrical target material joined to an outer peripheral side of the cylindrical substrate and integrally formed so as to have a length of 750 mm or more in an axial direction, wherein a variation coefficient of a bulk resistivity in an axial direction is 0.05 or less on the outer peripheral surface of the cylindrical target material.
CYLINDRICAL SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
A cylindrical sputtering target according to the present invention comprises: a metallic cylindrical substrate; and a ceramic cylindrical target material joined to an outer peripheral side of the cylindrical substrate and integrally formed so as to have a length of 750 mm or more in an axial direction, wherein a variation coefficient of a bulk resistivity in an axial direction is 0.05 or less on the outer peripheral surface of the cylindrical target material.
CYLINDRICAL SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
TSURUTA YOSHITAKA (author) / NEGISHI TOMOYA (author)
2019-11-28
Patent
Electronic Resource
English
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