A platform for research: civil engineering, architecture and urbanism
METHOD FOR MANUFACTURING BONDED BODY
A method for manufacturing a bonded body according to the present disclosure includes: obtaining a first composite that includes a first outer layer portion located on an outer surface side and containing silicon oxide as a main component, and a first inner portion surrounded by the first outer layer portion and containing silicon carbide and silicon; obtaining a second composite that includes a second outer layer portion located on an outer surface side and containing silicon oxide as a main component, and a second inner portion surrounded by the second outer layer portion and containing silicon carbide and silicon; grinding or polishing a first contact surface at which the first inner portion is in contact with the second inner portion and/or a second contact surface at which the second inner portion is in contact with the first inner portion; and bringing the first contact surface and the second contact surface into contact with each other and performing thermal treatment in a vacuum atmosphere or an inert gas atmosphere.
METHOD FOR MANUFACTURING BONDED BODY
A method for manufacturing a bonded body according to the present disclosure includes: obtaining a first composite that includes a first outer layer portion located on an outer surface side and containing silicon oxide as a main component, and a first inner portion surrounded by the first outer layer portion and containing silicon carbide and silicon; obtaining a second composite that includes a second outer layer portion located on an outer surface side and containing silicon oxide as a main component, and a second inner portion surrounded by the second outer layer portion and containing silicon carbide and silicon; grinding or polishing a first contact surface at which the first inner portion is in contact with the second inner portion and/or a second contact surface at which the second inner portion is in contact with the first inner portion; and bringing the first contact surface and the second contact surface into contact with each other and performing thermal treatment in a vacuum atmosphere or an inert gas atmosphere.
METHOD FOR MANUFACTURING BONDED BODY
HORIUCHI MASAHIKO (author) / MANOME TAKEO (author) / MIYAZAKI SHINYA (author)
2024-06-06
Patent
Electronic Resource
English
BONDED BODY MANUFACTURING METHOD AND BONDED BODY MANUFACTURING DEVICE
European Patent Office | 2021
|European Patent Office | 2021
|BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING BONDED BODY
European Patent Office | 2023
|