A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COMPOSITE MATERIAL SINTERED BODY, JOINED ASSEMBLY, SEMICONDUCTOR MANUFACTURING APPARATUS MEMBER, AND COMPOSITE MATERIAL SINTERED BODY MANUFACTURING METHOD
A composite material sintered body includes silicon carbide, tungsten silicide, and tungsten carbide, contains 14.4 wt % or more and 48.6 wt % or less of silicon carbide, and has an open porosity of 1% or less.
COMPOSITE MATERIAL SINTERED BODY, JOINED ASSEMBLY, SEMICONDUCTOR MANUFACTURING APPARATUS MEMBER, AND COMPOSITE MATERIAL SINTERED BODY MANUFACTURING METHOD
A composite material sintered body includes silicon carbide, tungsten silicide, and tungsten carbide, contains 14.4 wt % or more and 48.6 wt % or less of silicon carbide, and has an open porosity of 1% or less.
COMPOSITE MATERIAL SINTERED BODY, JOINED ASSEMBLY, SEMICONDUCTOR MANUFACTURING APPARATUS MEMBER, AND COMPOSITE MATERIAL SINTERED BODY MANUFACTURING METHOD
IBATA KANA (author) / NAGAI ASUMI (author) / INOUE KATSUHIRO (author)
2024-10-03
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
C22C
Legierungen
,
ALLOYS
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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