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Composite material sintered body, bonded body, member for semiconductor manufacturing device, and method for manufacturing composite material sintered body
The invention relates to a composite material sintered body, a bonded body, a member for a semiconductor manufacturing device, and a method for manufacturing the composite material sintered body, and provides a compact composite material sintered body which is composed of a constituent phase different from that in the prior art and has a linear thermal expansion coefficient difference with aluminum nitride equal to or smaller than that in the prior art. The composite material sintered body is composed of silicon carbide, tungsten silicide, and tungsten carbide, contains 14.4 wt% or more and 48.6 wt% or less of silicon carbide, and has an open porosity of 1% or less.
本发明涉及复合材料烧结体、接合体、半导体制造装置用部件及复合材料烧结体的制造方法，提供由与以往不同的构成相构成、与氮化铝的线热膨胀系数差与以往同等或者比以往小、且致密质的复合材料烧结体。复合材料烧结体由碳化硅、硅化钨、以及碳化钨构成，含有14.4wt％以上且48.6wt％以下的碳化硅，开口气孔率为1％以下。
Composite material sintered body, bonded body, member for semiconductor manufacturing device, and method for manufacturing composite material sintered body
The invention relates to a composite material sintered body, a bonded body, a member for a semiconductor manufacturing device, and a method for manufacturing the composite material sintered body, and provides a compact composite material sintered body which is composed of a constituent phase different from that in the prior art and has a linear thermal expansion coefficient difference with aluminum nitride equal to or smaller than that in the prior art. The composite material sintered body is composed of silicon carbide, tungsten silicide, and tungsten carbide, contains 14.4 wt% or more and 48.6 wt% or less of silicon carbide, and has an open porosity of 1% or less.
本发明涉及复合材料烧结体、接合体、半导体制造装置用部件及复合材料烧结体的制造方法，提供由与以往不同的构成相构成、与氮化铝的线热膨胀系数差与以往同等或者比以往小、且致密质的复合材料烧结体。复合材料烧结体由碳化硅、硅化钨、以及碳化钨构成，含有14.4wt％以上且48.6wt％以下的碳化硅，开口气孔率为1％以下。
Composite material sintered body, bonded body, member for semiconductor manufacturing device, and method for manufacturing composite material sintered body
复合材料烧结体、接合体、半导体制造装置用部件及复合材料烧结体的制造方法
IHATA KANA (author) / NAGAI ASUMI (author) / INOUE KATSUHIRO (author)
2024-10-01
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
| European Patent Office | 2024
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