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A platform for research: civil engineering, architecture and urbanism
MICROSTRUCTURE CONTROL OF CONDUCTING MATERIALS THROUGH SURFACE COATING OF POWDERS
Exemplary deposition methods may include introducing hydrogen into a processing chamber, a powder disposed within a processing region of the processing chamber. The method may include striking a first plasma in the processing region, the first plasma including energetic hydrogen species. The method may include exposing the powder to the energetic hydrogen species in the processing region. The method may include chemically reducing the powder through a reaction of the powder with the energetic hydrogen species. The method may include removing process effluents including unreacted hydrogen from the processing region. The method may also include forming a layer of material on grains of the powder within the processing region.
MICROSTRUCTURE CONTROL OF CONDUCTING MATERIALS THROUGH SURFACE COATING OF POWDERS
Exemplary deposition methods may include introducing hydrogen into a processing chamber, a powder disposed within a processing region of the processing chamber. The method may include striking a first plasma in the processing region, the first plasma including energetic hydrogen species. The method may include exposing the powder to the energetic hydrogen species in the processing region. The method may include chemically reducing the powder through a reaction of the powder with the energetic hydrogen species. The method may include removing process effluents including unreacted hydrogen from the processing region. The method may also include forming a layer of material on grains of the powder within the processing region.
MICROSTRUCTURE CONTROL OF CONDUCTING MATERIALS THROUGH SURFACE COATING OF POWDERS
SHULL MARC (author) / REIMER PETER (author) / GAO HONG P (author) / DESHPANDEY CHANDRA V (author)
2024-11-14
Patent
Electronic Resource
English
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