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Copper bonding layer nickel alloy composition for copper-bonded nitride substrate
The present application relates to a nitride substrate, such as AlN, Si3N4 or the like, to which a copper layer is bonded, and more particularly, to a composition of a copper bonding layer formed to improve the bonding strength and thermoelectric properties between the nitride substrate and the copper layer, a laminated substrate, and a method for manufacturing the same. When the copper bonding layer nickel alloy composition for a copper-bonded nitride substrate according to the present application is used, a copper-bonded nitride substrate having improved bonding force can be manufactured by forming an alloy metal layer between a nitride and a copper layer.
本申请，涉及一种接合有铜层的氮化物基板，如AlN、Si3N4等，更具体地，涉及一种用于提高氮化物基板和铜层之间的接合强度以及热电特性而形成的铜接合层的组合物及层压基板、其基板的制造方法。当使用本申请的铜接合氮化物基板用铜接合层镍合金组合物时，在氮化物与铜层之间形成合金金属层，从而可以制造接合力得到提高的铜接合氮化物基板。
Copper bonding layer nickel alloy composition for copper-bonded nitride substrate
The present application relates to a nitride substrate, such as AlN, Si3N4 or the like, to which a copper layer is bonded, and more particularly, to a composition of a copper bonding layer formed to improve the bonding strength and thermoelectric properties between the nitride substrate and the copper layer, a laminated substrate, and a method for manufacturing the same. When the copper bonding layer nickel alloy composition for a copper-bonded nitride substrate according to the present application is used, a copper-bonded nitride substrate having improved bonding force can be manufactured by forming an alloy metal layer between a nitride and a copper layer.
本申请，涉及一种接合有铜层的氮化物基板，如AlN、Si3N4等，更具体地，涉及一种用于提高氮化物基板和铜层之间的接合强度以及热电特性而形成的铜接合层的组合物及层压基板、其基板的制造方法。当使用本申请的铜接合氮化物基板用铜接合层镍合金组合物时，在氮化物与铜层之间形成合金金属层，从而可以制造接合力得到提高的铜接合氮化物基板。
Copper bonding layer nickel alloy composition for copper-bonded nitride substrate
铜接合氮化物基板用铜接合层镍合金组合物
KIM GUN-HO (Autor:in) / SEO JONG-HYUN (Autor:in)
30.08.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
NICKEL ALLOY COMPOSITION FOR COPPER-BONDING LAYER FOR COPPER-BONDED NITRIDE SUBSTRATE
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