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Electromigration resistance of TiWN/Cu/TiWN interconnections
Electromigration resistance of TiWN/Cu/TiWN interconnections
Electromigration resistance of TiWN/Cu/TiWN interconnections
Fukada, T. (Autor:in) / Mori, T. (Autor:in) / Toyoda, Y. (Autor:in) / Hasegawa, M. (Autor:in) / Namba, K. (Autor:in) / Ogata, K. (Autor:in) / Gessner, T / Schulz, S. E.
01.01.1996
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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