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Time dependence of stress and hillock distributions during electromigration in thin metal film interconnections
Time dependence of stress and hillock distributions during electromigration in thin metal film interconnections
Time dependence of stress and hillock distributions during electromigration in thin metal film interconnections
Klinger, L. (Autor:in) / Glickman, E. (Autor:in) / Katsman, A. (Autor:in) / Levin, L. (Autor:in)
01.01.1994
15 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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