Electromigration resistance of TiWN/Cu/TiWN interconnections: Fid-Bau Portal

Electromigration resistance of TiWN/Cu/TiWN interconnections

Fukada, T. / Mori, T. / Toyoda, Y. / Hasegawa, M. / Namba, K. / Ogata, K.

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Electromigration resistance of TiWN/Cu/TiWN interconnections

Fukada, T. / Mori, T. / Toyoda, Y. / Hasegawa, M. / Namba, K. / Ogata, K.

Electromigration resistance of TiWN/Cu/TiWN interconnections

Fukada, T. / Mori, T. / Toyoda, Y. / Hasegawa, M. / Namba, K. / Ogata, K.

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Check availability in my library

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Document information

Title:

Electromigration resistance of TiWN/Cu/TiWN interconnections

Contributors:

Fukada, T. (author) / Mori, T. (author) / Toyoda, Y. (author) / Hasegawa, M. (author) / Namba, K. (author) / Ogata, K. (author) / Gessner, T / Schulz, S. E.

Published in:

Materials for Advanced Metallization ; 227-233

APPLIED SURFACE SCIENCE ; 91

Publication date:

1996-01-01

Size:

7 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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