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Analysis of sidewall buildup during trilevel resist etching of metal
Analysis of sidewall buildup during trilevel resist etching of metal
Analysis of sidewall buildup during trilevel resist etching of metal
Ha, J. H. (Autor:in) / Jung, J.-K. (Autor:in) / Seol, Y.-S. (Autor:in) / Park, H.-K. (Autor:in) / Shin, E.-J. (Autor:in) / Kim, D.-H. (Autor:in)
APPLIED SURFACE SCIENCE ; 119 ; 363-368
01.01.1997
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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