Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites
Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites
Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites
Legois, V. (Autor:in) / Aucouturier, M. (Autor:in) / Ollivier, E. (Autor:in) / Darque-Ceretti, E. (Autor:in) / Macheto, P. (Autor:in)
SURFACE ENGINEERING -LONDON- ; 14 ; 259-264
01.01.1998
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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