Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Low dielectric constant materials and methods for interlayer dielectric films in ultralarge-scale integrated circuit multilevel interconnections
Homma, T. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- R REPORTS- ; 23 ; 243-285
01.01.1998
43 pages
Aufsatz (Zeitschrift)
Englisch
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