Mechanical strength of chip scale package with various underfills under accelerated thermal condition

Noh, B.-I. / Lee, B.-Y. / Jung, S.-B. | British Library Online Contents | 2007

Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock

Noh, B. I. / Jung, S. B. | British Library Online Contents | 2006

Novel high performance no flow and reworkable underfills for flip-chip applications

Wong, C. P. / Wang, L. / Shi, S.-H. | British Library Online Contents | 1999

Reliability Analysis in Flip Chip Package under Thermal Cycling

Yeh, M. K. / Tsai, C. Y. | British Library Online Contents | 2004

Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test

Kim, D. G. / Kim, J. W. / Ha, S. S. et al. | British Library Online Contents | 2007