Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Mechanical strength of chip scale package with various underfills under accelerated thermal condition
Mechanical strength of chip scale package with various underfills under accelerated thermal condition
Mechanical strength of chip scale package with various underfills under accelerated thermal condition
Noh, B.-I. (Autor:in) / Lee, B.-Y. (Autor:in) / Jung, S.-B. (Autor:in)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 23 ; 828-832
01.01.2007
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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